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Keywords: soldering
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031012.
Published Online: September 30, 2011
.... It is well known that in nearly all soldering processes used in electronic industries, intermetallic compound (IMC) formation is essential to make a solder joint. In the pure Ag interconnect, no IMCs exist. Thus, reliability issues associated with IMCs are eliminated. Compared to tin-based lead-free solders...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021004.
Published Online: April 1, 2009
...Zongjie Han; Songbai Xue; Jianxin Wang; Xin Zhang; Shenglin Yu; Liang Zhang In this paper, soldering experiments of fine pitch quad flat package (QFP) devices were carried out when soldered with Sn–Ag–Cu and Sn–Cu–Ni lead-free solders by means of diode laser soldering system, and compared...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011007.
Published Online: February 12, 2009
... and is widely adopted throughout the industry. In this research the solder loading is investigated by combining high-speed camera measurements of several drop impact tests with verified finite element models. These simulation models are developed in order to gain an insight on the loading pattern of solder...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031008.
Published Online: August 1, 2008
...Hao Lu; Chun Yu; Peilin Li; Junmei Chen The current density distribution in a line-to-bump structure as a function of cross-sectional area ratio of the electrical conductor was investigated, as well as the effects of current crowding on electromigration and interfacial reaction in lead-free solder...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031009.
Published Online: August 1, 2008
...Jin Yang; I. Charles Ume Solder bump inspection of surface mount packages has been a crucial process in the electronics manufacturing industry. A solder bump inspection system has been developed using laser ultrasound and interferometric techniques. In this research, modal analysis is important...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 496–503.
Published Online: August 27, 2007
...John H. L. Pang; F. X. Che Isothermal three-point and four-point cyclic bend fatigue test methods have been developed for Sn–Ag–Cu solder joints. Reported bend tests from the literature were conducted at room temperature (25°C) and there is lack of data for lead-free solder joints. In this study...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 405–411.
Published Online: October 4, 2006
... the solder bump reliability, if the underfills do not prematurely delaminate or crack. Therefore, it is necessary to understand the risk of underfill delamination during assembly and during further thermal excursions. In this paper, the interface between silicon nitride ( SiN ) passivation and a nano-filled...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 278–286.
Published Online: July 20, 2006
...Gang Chen; Xu Chen; Kwang Soo Kim; Mohammad Abdel-Karim; Masao Sakane A series of multiaxial ratcheting tests were conducted on 63Sn–37Pb solder. A unified viscoplastic constitutive model was developed on the basis of the Ohno–Wang kinematic hardening model, and the rate dependence of the material...
Journal Articles
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. December 2005, 127(4): 537–538.
Published Online: December 1, 2005
... soldering solders Dr. Jennie Hwang’s book, Environment-Friendly Electronics: Lead-Free Technology , is a welcome reference to today’s engineers working in the electronics industry. Green technology continues to spread throughout the industry and now is the time for some accurate references to make...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 77–85.
Published Online: June 3, 2005
... of the package. Package reliability can be improved by the application of an underfill. In this paper, we report the development of novel underfill materials utilizing nano-filler technology, which provides a previously unobtainable balance of low CTE and good solder joint formation. silicon compounds flip...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 512–522.
Published Online: May 3, 2005
...Qian Zhang; Abhijit Dasgupta; Peter Haswell This study is motivated by the urgent need in the electronics industry for mechanical properties and durability of Pb-free solders because the use of Pb will be banned in the EU by July 1, 2006. The isothermal mechanical durability of three NEMI...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 340–352.
Published Online: December 10, 2004
... (PCBs) are attributed to stencil printing 1 . Manufacturing techniques for the assembly of certain flip chips, chip scale packages, 0201s, and fine pitch ball grid arrays are testing the limits of current stencil printing capabilities. This paper focuses on understanding the release of solder paste from...
Topics: Printing, Solders
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 91–95.
Published Online: November 25, 2004
...Andrzej Mościcki; Jan Felba; Tadeusz Sobierajski; Józef Kudzia Pb-free soldering and the use of electrically conducive adhesives in the electronics industry are a segment of the global trend towards a lead-free environment. In comparison to lead-free solders, current commercial isotropic conductive...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 157–163.
Published Online: September 15, 2004
...C. Basaran; H. Ye; D. C. Hopkins; D. Frear; J. K. Lin The failure modes of flip chip solder joints under high electrical current density are studied experimentally. Three different failure modes are reported. Only one of the failure modes is caused by the combined effect of electromigration...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 268–275.
Published Online: July 28, 2004
... of thermal stresses and hygrostresses that arise during solder reflow of plastic IC packages. In recent years interfacial fracture mechanics has been applied successfully to the analysis of delamination or crack propagation along interfaces in plastic IC packages. This paper presents some fundamental aspects...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 208–214.
Published Online: July 23, 2004
...C. Basaran; Y. Zhao; H. Tang; J. Gomez Sn-Pb eutectic solder alloy is extensively used in microelectronics packaging interconnects. Due to the high homologous temperature, eutectic Sn-Pb solder exhibits creep-fatigue interaction and significant time-, temperature-, stress-, and rate-dependent...