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Keywords: surface energy
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Journal Articles

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

Xingjun Yao, Weijie Jiang, Jiahui Yang, Junjie Fang, Wenjun Zhang
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041003.
Paper No: EP-20-1094
DOI: https://doi.org/10.1115/1.4052275
Published Online: November 22, 2021
...Xingjun Yao; Weijie Jiang; Jiahui Yang; Junjie Fang; Wenjun Zhang This paper presents a new approach to formulating an analytical model for the underfill process in flip-chip packaging to predict the flow front and the filling time. The new approach is based on the concept of surface energy along...
View Article titled, A <span class="search-highlight">Surface</span> <span class="search-highlight">Energy</span> Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging
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Topics: Computational fluid dynamics, Flip-chip, Flip-chip packages, Flow (Dynamics), Simulation, Solders, Surface energy, Uncertainty, Shapes, Packaging
Journal Articles

Simultaneous Electrothermal Test Method for Pyroelectric Microsensors

Brian Smith, Cristina Amon
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 504–511.
DOI: https://doi.org/10.1115/1.2804101
Published Online: August 19, 2007
... 0015-0193 , 118 , pp. 363 – 378 . infrared detectors measurement by laser beam pyroelectric detectors surface energy thermal conductivity thermal diffusion film thermal conductivity pyroelectric coefficient measurement infrared sensor IRFPA One of the highest growth...
View Article titled, Simultaneous Electrothermal Test Method for Pyroelectric Microsensors
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Topics: Heat, Manufacturing, Sensors, Temperature, Thermal conductivity, Thermal diffusion, Thermal properties, Boundary-value problems, Microsensors, Strips