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Keywords: thermal resistance
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031017.
Paper No: EP-21-1164
Published Online: May 19, 2022
... alternating inlet and outlet branched internal channels. It was found that using the manifold design with 3 channels reduced the thermal resistance from 0.061 to 0.054 °C/W with a pressure drop reduction of 0.77 kPa from the commercial cold plate. A geometric parametric study was performed to investigate...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 011001.
Paper No: EP-13-1112
Published Online: March 10, 2016
... at bare and commercial thermal paste coated Cu substrates boundary conditions. The influence of interface material thickness on total thermal resistance (R th-tot ), rise in junction temperature (T J ), and optical properties of LED was analyzed. A noticeable reduction in R th-tot (5.92 K/W) as well as T...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2014, 136(3): 034502.
Paper No: EP-13-1099
Published Online: May 12, 2014
... boundary condition was not supported to reduce the T J . The total thermal resistance (R th-tot ) was reduced for AlN-coated Cu substrate at 350 mA. The thermal resistance between metal core printed circuit board and Cu substrate (R th-b-hs ) was also observed as low for AlN-coated Cu substrates compared...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011012.
Paper No: EP-13-1045
Published Online: February 18, 2014
... the thermal resistance of Sn-Bi solder paste used as thermal interface material (TIM) by laser flash technique, and a thermal resistance less than 5 mm 2 K/W was achieved for the Sn-Bi TIM. The Sn-Bi solder also showed a good reliability in terms of thermal resistance after thermal cycling, indicating...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021005.
Paper No: EP-12-1070
Published Online: March 28, 2013
..., the nanofluid charged MPHPs have a lower thermal resistance relative to the water charged ones. For ferrofluid charged MPHP, the application of a magnetic field substantially reduces the thermal resistance. This study proposes an outstanding technique for the thermal management of electronics. thermal...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041009.
Published Online: December 9, 2011
... of heat load, and height difference between the cooler and heater. A theoretical thermal resistance model was established and convective heat transfer coefficient was calculated to interpret the phenomenon with uncertainty analyzed. With further improvement of the present system and liquid metal coolant...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041008.
Published Online: December 9, 2011
... resistance between the solid and the cavity. The optimization procedure has demonstrated that for larger solids, a cavity shaped as T led to a minimization of the global thermal resistance, while the opposite effect is observed for tall solids, where the optimal shapes are reached when the bifurcated...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031008.
Published Online: September 21, 2011
... strategies in data centers. Finally, the impact of heat sink thermal resistance is considered, and the potential data center efficiency gains from improved heat sink designs are discussed. 07 04 2011 09 05 2011 21 09 2011 21 09 2011 computer centres cooling fans heat sinks...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021006.
Published Online: June 23, 2011
... of simplified approaches. After a review of the available modeling strategies, steady state thermal analysis of a typical stacked ball grid array package based on a thermal resistance network is presented. The physical model is discussed in detail, together with its advantages and limitations. The results have...
Journal Articles
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020902.
Published Online: June 7, 2011
... transfer materials testing thermal conductivity thermal interface materials carbon nanotubes thermal resistance Thermal interface materials (TIMs) are used in electronics packaging to increase heat conduction across the interface between two relatively flat surfaces. A good TIM will have...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011008.
Published Online: March 10, 2011
...Xiaoling Yu; Lianghua Zhang; Enming Zhou; Quanke Feng Presently, many methods are adopted to reduce the junction-to-case thermal resistance ( R jc ) of insulated-gate bipolar transistor (IGBT) modules in order to increase their power density. One of these approaches is to enhance the heat spreading...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. March 2011, 133(1): 014501.
Published Online: March 9, 2011
... can be maximized by improving the thermal resistance over 40%, and the conventional TVC can be further reduced by 35%. The proposed approach is demonstrated on the multifinger InGaP/GaAs C-up HBT, which is attractive as the active component in power amplifiers. A comparison of measured, finite-element...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041009.
Published Online: November 24, 2010
... number per unit volume. The channels had rectangular cross-sections with hydraulic diameters ranging from 0.762 mm to 1.389 mm. Acetone, water, diamond/acetone, gold/water, and diamond/water nanofluids were tested as working fluids. It was found that the FP-OHP’s thermal resistance depended on the power...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031009.
Published Online: September 9, 2010
... fabricated to evaluate the cooling performance of this liquid metal cooling device. The compared results with typical water cooling and commercially available heat pipes show that the present device could achieve excellent cooling capability. The thermal resistance could be as low as 0.13 ° C / W , which...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031004.
Published Online: September 9, 2010
... effects due to a misconception about the meaning of often-quoted flux limits and especially the physical meaning of thermal resistance. The usefulness of a number of approaches that are generally in use to analyze heat spreading effects is discussed and it is shown that the popular series-resistance...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021005.
Published Online: June 23, 2010
... 26 03 2010 23 06 2010 23 06 2010 cooling electronics industry elemental semiconductors heat pipes microfabrication silicon thermal conductivity thermal resistance microheat pipes electronic cooling thermal conductivity thermal resistance performance enhancement...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021004.
Published Online: June 11, 2010
...Xi Liu; Jiantao Zheng; Suresh K. Sitaraman The thermal efficacy of thermal interface material (TIM) is highly dependent on its ability to adhere to the surfaces of interest. Any delamination of the TIM from the die or the lid will increase the local thermal resistance and, thus, will reduce...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011001.
Published Online: February 25, 2010
... thermal management (packaging) thermal resistance thermal resistance measurement 1 Nowadays the quality of thermal interface materials (TIMs) has a growing importance as the increasing dissipation level of integrated circuits (ICs) requires more and more sophisticated solutions to reduce...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041005.
Published Online: October 21, 2009
... vapor cell. Each of these must be maintained at 70 + / − 0.1 ° C even over large ambient temperature variations of 0 – 50 ° C . Thus the physics package of a CSAC device, which contains the vapor cell, VCSEL, and optical components, must have a very high thermal resistance, greater than 5.83 ° C / m W...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031009.
Published Online: July 14, 2009
... by itself was found to contribute more than half of the overall thermal resistance of the cooling device. The thermal spreading resistance of the block can be reduced by about 70% if a piece of high-conductivity material, such as a diamond-copper composite, is inserted into its base. The thermal spreading...