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Keywords: three-dimensional packaging
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Technology Review
J. Electron. Packag. June 2014, 136(2): 024002.
Paper No: EP-14-1006
Published Online: April 29, 2014
... the application of fan-out WLP, 3D packaging integrating with WLP technologies and its application in microelectromechanical systems (MEMS). wafer level packaging fan-out WLP three-dimensional packaging reliability analysis MEMS review Chip scale package (CSP) is defined as the package that has...
