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Keywords: underfill encapsulation
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041009.
Paper No: EP-21-1137
Published Online: December 1, 2021
... package, while considering the filling time of the subsequent underfill encapsulation process. The design optimization approach was based on the latest regional segregation-based analytical filling time model. Numerical simulation was conducted to verify the governed analytical model. The discrepancies...
Journal Articles
Article Type: Review Articles
J. Electron. Packag. March 2022, 144(1): 010803.
Paper No: EP-21-1007
Published Online: August 6, 2021
... the FEM modeling of fluid flow problem such as the underfill flow in encapsulation process [ 53 ]. e-mail:  aizatabas@usm.my 16 01 2021 22 03 2021 06 08 2021 electronic packaging flip-chip package's reliability underfill encapsulation void occurrent Recent rapid...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041009.
Paper No: EP-19-1066
Published Online: October 18, 2019
... In electronic packaging, flip-chip package is a microelectronic assembly, which consists of a silicon die whose inputs/outputs were connected to the substrate through an array of solder bumps [ 1 ]. To promote the package's reliability, underfill encapsulation process is carried out by dispensing epoxy resin...