..., and density and kinematic viscosity of air. Finally, corresponding correlations are compared with the available two-dimensional studies in literature for infinite parallel plates. 22 12 2010 12 04 2011 14 09 2011 14 09 2011 cooling electronics packaging forced convection laminar...

...) of δ . The distributed forces acting on the edges of the die are resolved into the direction of δ . 29 11 2009 25 09 2010 08 12 2010 08 12 2010 chip-on-board packaging Couette flow flip-chip devices interconnections reflow soldering solders viscosity wafer...

.... This limitation has been previously highlighted (Eveloy, V. et al., 2004, IEEE Trans. Compon., Packag., Technol. 27 , pp. 268–282), with component junction temperature prediction errors of up to 35% reported. This study evaluates the potential of three candidate low-Reynolds number eddy viscosity turbulence...

...Ronald L. Panton, Fellow ASME; Jong W. Lee; Lakhi Goenka; Achyuta Achari This research studies the motion of void bubbles within molten solder bumps. Surface tension variation on the outer surface of the bump drives a flow that is transmitted to the interior by viscosity. Bubbles inside the bump...

... agreement. [S1043-7398(00)00101-8] semiconductor device packaging flow simulation finite element analysis microprocessor chips compressible flow encapsulation viscosity chip-on-board packaging Semiconductor chips are often encapsulated with an epoxy-molding compound (EMC) for protection...