... because the chipping and delamination caused at the wafer edge can be a critical failure during the backside processing of direct bonded wafers. Nevertheless, there are only a few reports which deeply investigate the edge trimming itself. 3D packaging Wafer level packaging 11 12 2017...

... or reproduce the published form of this work, or allow others to do so, for United States Government purposes. 16 02 2018 21 02 2018 3D packaging Battery technology Harsh environment High density interconnects Microsystems Optoelectronics Power packaging Sensors SOC Wafer level...

...Justin A. Weibel; S. Ravi Annapragada 22 03 2017 31 03 2017 3D packaging Backplanes Chip stacking Failure analysis Flexible circuits Nanotechnolgy Reliability Solder Thermal analysis Underfill Wafer level packaging ASME's International Mechanical Engineering...

.... , and Locker , D. , 2015 , “ Stress–Strain Behavior of SAC305 at High Strain Rates ,” ASME J. Electron. Packag. , 137 ( 1 ), p. 011010 . 10.1115/1.4028641 [2] Ranouta , A. S. , Fan , X. J. , and Han , Q. , 2009 , “ Shock Performance Study of Solder Joints in Wafer Level Packages...

... , J. , and Oh , J. , 2014 , “ Non-Conductive Film (NCF) Underfill for Flip Chip Assembly and High Reliability ,” International Wafer Level Packaging Conference ( IWLPC ), San Jose, CA, Nov. 11–13. [144] Lee , D. , Kim , K. , Kim , K. , Kim , H. , Kim , J. , Park , Y...

... OF E LECTRONIC P ACKAGING . Manuscript received June 30, 2014; final manuscript received September 16, 2015; published online October 12, 2015. Assoc. Editor: Susan Lu. 30 06 2014 16 09 2015 Flip chip Wafer level packaging Compliant interconnects are an emerging...

...Jia Xi; Xinduo Zhai; Jun Wang; Donglun Yang; Mao Ru; Fei Xiao; Li Zhang; Chi Ming Lai FeNi alloy is considered a possible substitute for Cu as under bump metallization (UBM) in wafer level package (WLP) since it forms very thin intermetallic compound (IMC) layer with Pb-free solder in the reflow...

... back to the evaporator as shown in Fig. 1 [ 1 ]. 3D packaging Flexible circuits MEMS Microsystems Nanotechnolgy Thermal analysis Wafer level packaging 04 08 2014 10 10 2014 Contributed by the Electronic and Photonic Packaging Division of ASME for publication...

... ACKAGING . Manuscript received January 7, 2014; final manuscript received April 6, 2014; published online April 29, 2014. Assoc. Editor: Gongnan Xie. 07 01 2014 06 04 2014 Fast development of wafer level packaging (WLP) in recent years is mainly owing to the advances in integrated...

... 04 03 2010 04 03 2010 finite element analysis integrated circuit reliability solders wafer level packaging Wafer-level chip scale packages (WCSPs) are gaining momentum in the market place recently ( 1 ). This is mainly due to low cost and good electrical performance. From...

... circuit manufacture printed circuits solders Taguchi methods wafer level packaging temperature cyclic loading Taguchi method lead-free solder wafer level chip scale package (WLCSP) Owing to the mismatch of coefficient of thermal expansion (CTE) between the chip and printed circuit...

... and laser techniques for structuring the metallization layer have been applied to generate structures for reliable interconnects capable for the use of lead-free solders. Summarized, this paper presents the process development and feasibility analysis of wafer level packaging technologies for modular SiP...

...Y. T. Lin, Graduate Assistant; C. T. Peng, Graduate Assistant; K. N. Chiang, Associate Professor The demands for electronic packages with lower profile, lighter weight, and higher input/output (I/O) density have led to rapid expansion in flip chip, chip scale package (CSP) and wafer level packaging...