A theoretical approach based on gaskinetic theory is described and applied for the modeling of steady-state free-molecule gaseous heat conduction within a diffusive enclosure. With a representative model of microelectromechanical system (MEMS) devices with integrated heaters, the heat transfer between the heated component and its gaseous ambient enclosed in a high vacuum is studied in detail. A molecular simulation based on the direct simulation Monte Carlo (DSMC) method is also employed to validate the theoretical solutions and to study the effects of incomplete thermal accommodation. The impacts of the finite size of the heated beam as well as the gap between the beam and a substrate on the heat transfer are investigated to examine the appropriateness of the common assumptions employed in the modeling of Pirani sensors. Interesting phenomena that are unique in the free-molecule regime are observed and discussed. These studies are valuable to the design of MEMS devices with microheaters.
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Research Papers
Theoretical Two-Dimensional Modeling of Gas Conduction Between Finite Parallel Plates in High Vacuum
Taishan Zhu,
Taishan Zhu
Hong Kong University of Science and Technology,Clear Water Bay, Kowloon,
Hong Kong, China
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Wenjing Ye
e-mail: mewye@ust.hk
Wenjing Ye
Hong Kong University of Science and Technology,Clear Water Bay, Kowloon,
Hong Kong, China
Search for other works by this author on:
Taishan Zhu
Hong Kong University of Science and Technology,Clear Water Bay, Kowloon,
Hong Kong, China
Wenjing Ye
Hong Kong University of Science and Technology,Clear Water Bay, Kowloon,
Hong Kong, China
e-mail: mewye@ust.hk
J. Heat Transfer. May 2012, 134(5): 051013 (6 pages)
Published Online: April 13, 2012
Article history
Received:
April 26, 2010
Revised:
August 25, 2010
Published:
April 11, 2012
Online:
April 13, 2012
Citation
Zhu, T., and Ye, W. (April 13, 2012). "Theoretical Two-Dimensional Modeling of Gas Conduction Between Finite Parallel Plates in High Vacuum." ASME. J. Heat Transfer. May 2012; 134(5): 051013. https://doi.org/10.1115/1.4005704
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