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Keywords: DRIE
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. May 2012, 134(5): 051012.
Published Online: April 13, 2012
... by the etching rate of reactive ion etching (RIE). Microchannels and access holes were etched with deep reactive ion etching (DRIE). Both nanochannels and microchannels were sealed by a Pyrex glass wafer using anodic bonding. The fabricated nanochannels were characterized by capillary filling and evaporation...