When a bar having one end bonded to a rigid support with foam-adhesive is loaded, the high peeling stresses at the bonded edge foster edge delamination along the interface of bonding. Upon inspection by double exposure holography, with an incremental point load applied at the free end of the bar between exposures, the indistinct fringe perturbation and the unknown resilience of the foam-adhesive (quantified by its foundation modulus) impede unambiguous evaluation of the condition of adhesion. This paper describes a simple method for rapid detection and assessment of artificially created edge delamination in such bar structures. The theoretical analysis elucidates the suitability of modelling the bar as partially clamped, and having an equivalent slope at its support related to the foundation modulus. Two dimensionless parameters are defined, which have between them a linear relationship for a nondelaminated bonding but a nonlinear relationship for a delaminated one. Finally, a simple iterative procedure is described for estimating the delaminated length without having to predetermine the elasticity of the support.
Skip Nav Destination
Article navigation
July 1996
Technical Papers
Holographic Evaluation of Edge Delamination in Bars Bonded to a Rigid Support With Foam-Adhesive
S. Qin,
S. Qin
Department of Mechanical and Production Engineering, National University of Singapore, Kent Ridge, Singapore 0511
Search for other works by this author on:
H. M. Shang,
H. M. Shang
Department of Mechanical and Production Engineering, National University of Singapore, Kent Ridge, Singapore 0511
Search for other works by this author on:
C. L. Giam,
C. L. Giam
Department of Mechanical and Production Engineering, National University of Singapore, Kent Ridge, Singapore 0511
Search for other works by this author on:
C. E. Tee
C. E. Tee
Department of Mechanical and Production Engineering, National University of Singapore, Kent Ridge, Singapore 0511
Search for other works by this author on:
S. Qin
Department of Mechanical and Production Engineering, National University of Singapore, Kent Ridge, Singapore 0511
H. M. Shang
Department of Mechanical and Production Engineering, National University of Singapore, Kent Ridge, Singapore 0511
C. L. Giam
Department of Mechanical and Production Engineering, National University of Singapore, Kent Ridge, Singapore 0511
C. E. Tee
Department of Mechanical and Production Engineering, National University of Singapore, Kent Ridge, Singapore 0511
J. Eng. Mater. Technol. Jul 1996, 118(3): 330-334 (5 pages)
Published Online: July 1, 1996
Article history
Received:
June 3, 1995
Revised:
February 4, 1996
Online:
November 27, 2007
Citation
Qin, S., Shang, H. M., Giam, C. L., and Tee, C. E. (July 1, 1996). "Holographic Evaluation of Edge Delamination in Bars Bonded to a Rigid Support With Foam-Adhesive." ASME. J. Eng. Mater. Technol. July 1996; 118(3): 330–334. https://doi.org/10.1115/1.2806814
Download citation file:
Get Email Alerts
Cited By
Forming limits of thin ferritic stainless steel for fuel cell application
J. Eng. Mater. Technol
2024 Reviewer's Recognition
J. Eng. Mater. Technol
Related Articles
Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging
J. Electron. Packag (June,2008)
Interfacial Fracture Toughness Measurement of a Ti/Si Interface
J. Electron. Packag (September,2004)
Revisiting the Constrained Blister Test to Measure Thin Film Adhesion
J. Appl. Mech (July,2017)
Related Proceedings Papers
Related Chapters
Durability of Bonded Housing Components
Durability of Adhesive Joints
Surface Analysis and Tools
Tribology of Mechanical Systems: A Guide to Present and Future Technologies
Can the Service Life of Bonds Be Predicted?
Durability of Adhesive Joints