..., respectively. It was found that the average activation energies were 112.4 kJ mol − 1 and 143.5 kJ mol − 1 for the pure Cu and CuCrAg alloys, respectively. These activation energies are close to 138 kJ mol − 1 for dislocation climb in Cu. This, together with the stress exponents of about 7, suggests...

... received July 8, 2002. Associate Editor: E. Werner. 22 November 2001 08 July 2002 31 12 2002 tin alloys lead alloys diffusion creep slip dislocation climb eutectic alloys soldering 63Sn/37Pb eutectic solder is commonly used in electronic packaging for both mechanical...