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Proceedings Papers

Analysis of Conjugate Heat Transfer in a Three-Dimensional Microchannel Heat Sink for Cooling of Electronic Components

Andrei G. Fedorov, Raymond Viskanta

Proc. ASME. IMECE99, Heat Transfer: Volume 3, 89-98, November 14–19, 1999

Paper No: IMECE1999-1066

DOI: https://doi.org/10.1115/IMECE1999-1066

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Topics: Cooling, Electronic components, Heat sinks, Heat transfer, Microchannels, Fluids, Design, Electronic packaging, Energy conservation, Flow (Dynamics)

Proceedings Papers

Apparent Radiative Properties and Radiation Scattering by a Semitransparent Hemispherical Shell

Tai-Hsi Fan, Andrei G. Fedorov

Proc. ASME. IMECE2001, Heat Transfer: Volume 4 — Combustion and Energy Systems, 251-258, November 11–16, 2001

Paper No: IMECE2001/HTD-24266

DOI: https://doi.org/10.1115/IMECE2001/HTD-24266

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Topics: Radiation scattering, Shells, Manufacturing, Foams (Chemistry), Glass melting, Heating, Materials processing, Radiation (Physics), Radiative heat transfer, Ray tracing

Proceedings Papers

Combined Radiation and Conduction in Glass Foams

Mark J. Varady, Andrei G. Fedorov

Proc. ASME. IMECE2001, Heat Transfer: Volume 4 — Combustion and Energy Systems, 235-241, November 11–16, 2001

Paper No: IMECE2001/HTD-24264

DOI: https://doi.org/10.1115/IMECE2001/HTD-24264

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Topics: Foams (Chemistry), Glass, Heat conduction, Radiation (Physics), Heat transfer, Approximation, Bubbles, Combustion gases, Electromagnetic scattering, Energy conservation

Proceedings Papers

Brazings for Metal-Ceramic Joining in Sodium Thermal Electrochemical Converter (Na-TEC) Devices

Andrey Gunawan, Jong Min Ha, Diane M. England, Alexander Limia, Peter A. Kottke, Andrei G. Fedorov, Seung Woo Lee, Shannon K. Yee

Proc. ASME. ES2018, ASME 2018 12th International Conference on Energy Sustainability, V001T07A008, June 24–28, 2018

Paper No: ES2018-7517

DOI: https://doi.org/10.1115/ES2018-7517

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Topics: Ceramics, Joining, Metals, Sodium, Thermoelectric coolers, Brazing, Alloys, Electrolytes, Pressure, Carbon

Proceedings Papers

Techno-Economic Analysis of Dual-Stage Sodium Thermal Electrochemical Converter (Na-TEC) Power Block for Distributed CSP

Andrey Gunawan, Alexander Limia, Jong Min Ha, Peter A. Kottke, Seung Woo Lee, Andrei G. Fedorov, Shannon K. Yee

Proc. ASME. ES2018, ASME 2018 12th International Conference on Energy Sustainability, V001T11A008, June 24–28, 2018

Paper No: ES2018-7505

DOI: https://doi.org/10.1115/ES2018-7505

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Topics: Sodium, Thermoelectric coolers, Design, Generators, Manufacturing, Temperature, Cycles, Electrodes, Heat, Heat engines

Journal Articles

Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps

Mohamed H. Nasr, Craig E. Green, Peter A. Kottke, Xuchen Zhang, Thomas E. Sarvey, Yogendra K. Joshi, Muhannad S. Bakir, Andrei G. Fedorov

J. Electron. Packag. March 2017, 139(1): 011006.

Paper No: EP-16-1097

DOI: https://doi.org/10.1115/1.4035387

Published Online: January 5, 2017

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Topics: Boiling, Flow (Dynamics), Flux (Metallurgy), Heat, Thermal resistance, Heat flux, Wall temperature, Coolants, Pressure drop, Thermal management

Journal Articles

Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

Xuchen Zhang, Xuefei Han, Thomas E. Sarvey, Craig E. Green, Peter A. Kottke, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir

J. Electron. Packag. March 2016, 138(1): 010910.

Paper No: EP-15-1107

DOI: https://doi.org/10.1115/1.4032496

Published Online: March 10, 2016

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Topics: Cooling, Design, Fins, Flow (Dynamics), Heat flux, Heat sinks, Heat transfer coefficients, Microfluidics, Temperature, Testing

Proceedings Papers

Performance and Integration Implications of Addressing Localized Hotspots Through Two Approaches: Clustering of Micro Pin-Fins and Dedicated Microgap Coolers

Craig E. Green, Peter A. Kottke, Thomas E. Sarvey, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A056, July 6–9, 2015

Paper No: IPACK2015-48537

DOI: https://doi.org/10.1115/IPACK2015-48537

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Topics: Coolers, Fins, Computer simulation, Cooling, Density, Flow (Dynamics), Flux (Metallurgy), Heat, Coolants, Design

Proceedings Papers

3D IC With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

Xuchen Zhang, Xuefei Han, Thomas E. Sarvey, Craig E. Green, Peter A. Kottke, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A008, July 6–9, 2015

Paper No: IPACK2015-48584

DOI: https://doi.org/10.1115/IPACK2015-48584

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Topics: Cooling, Microfluidics, Heat sinks, Atmospheric pressure, Coolants, Heat flux, Heat transfer coefficients, Pressure drop, Silicon, Testing

Journal Articles

Two-Phase Convective Cooling for Ultrahigh Power Dissipation in Microprocessors

Peter A. Kottke, Thomas M. Yun, Craig E. Green, Yogendra K. Joshi, Andrei G. Fedorov

J. Heat Transfer. January 2016, 138(1): 011501.

Paper No: HT-15-1103

DOI: https://doi.org/10.1115/1.4031111

Published Online: August 11, 2015

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Topics: Coolants, Cooling, Energy dissipation, Friction, Heat, Heat transfer, Pressure, Pressure drop, Temperature, Vapors

Journal Articles

Transient Characterization of Hybrid Microfluidic-Thermoelectric Cooling Scheme for Dynamic Thermal Management of Microprocessor

Vivek Sahu, Andrei G. Fedorov, Yogendra K. Joshi

J. Electron. Packag. September 2014, 136(3): 031014.

Paper No: EP-13-1105

DOI: https://doi.org/10.1115/1.4027901

Published Online: July 15, 2014

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Topics: Cooling, Superlattices, Temperature, Transients (Dynamics), Microchannels

Proceedings Papers

Shape Characterization for Droplet Impingement Dynamics in Ink-Jet Deposition

Wenchao Zhou, Drew Loney, Andrei G. Fedorov, F. Levent Degertekin, David W. Rosen

Proc. ASME. IDETC-CIE2012, Volume 2: 32nd Computers and Information in Engineering Conference, Parts A and B, 1313-1319, August 12–15, 2012

Paper No: DETC2012-71026

DOI: https://doi.org/10.1115/DETC2012-71026

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Topics: Drops, Dynamics (Mechanics), Inks, Shapes

Journal Articles

Absorption Heat Pump/Refrigeration System Utilizing Ionic Liquid and Hydrofluorocarbon Refrigerants

Sarah Kim, Yoon Jo Kim, Yogendra K. Joshi, Andrei G. Fedorov, Paul A. Kohl

J. Electron. Packag. September 2012, 134(3): 031009.

DOI: https://doi.org/10.1115/1.4007111

Published Online: July 23, 2012

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Topics: Absorption, Fluids, Heat pumps, Refrigerants, Refrigeration, Temperature, Pressure, Cooling, Heat

Proceedings Papers

Waste-Heat Driven Miniature Absorption Refrigeration System Using Ionic-Liquid as a Working Fluid

Yoon Jo Kim, Sarah Kim, Yogendra K. Joshi, Andrei G. Fedorov, Paul A. Kohl

Proc. ASME. ES2011, ASME 2011 5th International Conference on Energy Sustainability, Parts A, B, and C, 1299-1305, August 7–10, 2011

Paper No: ES2011-54217

DOI: https://doi.org/10.1115/ES2011-54217

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Topics: Absorption, Fluids, Refrigeration, Waste heat, Temperature, Refrigerants, Water, Computer cooling, Condensers (steam plant), Crystallization

Proceedings Papers

Gas Assisted Thin-Film Evaporation for Hotspot Thermal Management

Shankar Narayanan, Andrei G. Fedorov, Yogendra K. Joshi

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 671-674, August 8–13, 2010

Paper No: IHTC14-23015

DOI: https://doi.org/10.1115/IHTC14-23015

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Topics: Evaporation, Flux (Metallurgy), Heat, Thermal management, Thin films

Proceedings Papers

Hybrid Superlattice Coolers for Dynamic Thermal Management of Microprocessor Hotspots

Vivek Sahu, Yogendra K. Joshi, Andrei G. Fedorov

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 681-687, August 8–13, 2010

Paper No: IHTC14-23054

DOI: https://doi.org/10.1115/IHTC14-23054

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Topics: Coolers, Heat sinks, Microchannels, Superlattices, Thermal management

Proceedings Papers

Scaling Analysis of Performance Trade-Offs in Electronics Cooling

Craig E. Green, Andrei G. Fedorov, Yogendra K. Joshi

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1047-1056, July 19–23, 2009

Paper No: InterPACK2009-89389

DOI: https://doi.org/10.1115/InterPACK2009-89389

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Topics: Computer cooling, Tradeoffs, Cooling, Scaling laws (Mathematical physics), Coolants, Fluids, Geometry, Heat sinks, Heat transfer, Internal flow

Proceedings Papers

Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional IC With Non-Uniform Heat Flux

Yoon Jo Kim, Yogendra K. Joshi, Andrei G. Fedorov, Young-Joon Lee, Sung Kyu Lim

Proc. ASME. ICNMM2009, ASME 2009 7th International Conference on Nanochannels, Microchannels and Minichannels, 1249-1258, June 22–24, 2009

Paper No: ICNMM2009-82133

DOI: https://doi.org/10.1115/ICNMM2009-82133

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Topics: Cooling, Heat flux, Microfluidics, Thermal characterization, Refrigerants, Thermal management, Flow (Dynamics), Fluids, Geometry, Heat transfer coefficients

Journal Articles

Micromachined Ultrasonic Print-Head for Deposition of High-Viscosity Materials

J. Mark Meacham, Amanda O’Rourke, Yong Yang, Andrei G. Fedorov, F. Levent Degertekin, David W. Rosen

J. Manuf. Sci. Eng. June 2010, 132(3): 030905.

DOI: https://doi.org/10.1115/1.4001551

Published Online: May 19, 2010

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Topics: Fluids, Manganese (Metal), Manufacturing, Micromachining, Nozzles, Photopolymers, Piezoelectric transducers, Printing, Resins, Surface tension

Journal Articles

Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional Integrated Circuits With Nonuniform Heat Flux

Yoon Jo Kim, Yogendra K. Joshi, Andrei G. Fedorov, Young-Joon Lee, Sung-Kyu Lim

J. Heat Transfer. April 2010, 132(4): 041009.

DOI: https://doi.org/10.1115/1.4000885

Published Online: February 19, 2010

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Topics: Cooling, Heat flux, Microfluidics, Flow (Dynamics), Pressure drop, Integrated circuits, Fluids, Thermal management, Refrigerants

Journal citation

NARROW

Analysis of Conjugate Heat Transfer in a Three-Dimensional Microchannel Heat Sink for Cooling of Electronic Components

Apparent Radiative Properties and Radiation Scattering by a Semitransparent Hemispherical Shell

Combined Radiation and Conduction in Glass Foams

Brazings for Metal-Ceramic Joining in Sodium Thermal Electrochemical Converter (Na-TEC) Devices

Techno-Economic Analysis of Dual-Stage Sodium Thermal Electrochemical Converter (Na-TEC) Power Block for Distributed CSP

Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps

Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

Performance and Integration Implications of Addressing Localized Hotspots Through Two Approaches: Clustering of Micro Pin-Fins and Dedicated Microgap Coolers

3D IC With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

Two-Phase Convective Cooling for Ultrahigh Power Dissipation in Microprocessors

Transient Characterization of Hybrid Microfluidic-Thermoelectric Cooling Scheme for Dynamic Thermal Management of Microprocessor

Shape Characterization for Droplet Impingement Dynamics in Ink-Jet Deposition

Absorption Heat Pump/Refrigeration System Utilizing Ionic Liquid and Hydrofluorocarbon Refrigerants

Waste-Heat Driven Miniature Absorption Refrigeration System Using Ionic-Liquid as a Working Fluid

Gas Assisted Thin-Film Evaporation for Hotspot Thermal Management

Hybrid Superlattice Coolers for Dynamic Thermal Management of Microprocessor Hotspots

Scaling Analysis of Performance Trade-Offs in Electronics Cooling

Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional IC With Non-Uniform Heat Flux

Micromachined Ultrasonic Print-Head for Deposition of High-Viscosity Materials

Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional Integrated Circuits With Nonuniform Heat Flux

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