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Journal Articles

Special Issue on InterPACK2023

Ronald J. Warzoha, Damena Agonofer, Ashutosh Giri, Jimil Shah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2024, 146(4): 040301.
Paper No: EP-24-1089
https://doi.org/10.1115/1.4066727
Published Online: October 22, 2024
View Articletitled, Special Issue on InterPACK2023
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Topics: Electronic packaging, Electronics, Packaging, Cutting, Data centers, Energy storage, Engineering teachers, Machine learning, Mechanical engineers, Microelectromechanical systems
Journal Articles

Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging

Ronald J. Warzoha, Adam A. Wilson, Brian F. Donovan, Nazli Donmezer, Ashutosh Giri, Patrick E. Hopkins, Sukwon Choi, Darshan Pahinkar, Jingjing Shi, Samuel Graham, Zhiting Tian, Laura Ruppalt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020804.
Paper No: EP-20-1070
https://doi.org/10.1115/1.4049293
Published Online: February 22, 2021
View Articletitled, Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
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Topics: Electronics, Gallium nitride, Heat, Nanoscale phenomena, Phonons, Temperature, Thermal conductivity, Electromagnetic scattering, Energy gap, Diamonds
Journal Articles

On the Steady-State Temperature Rise During Laser Heating of Multilayer Thin Films in Optical Pump–Probe Techniques

Jeffrey L. Braun, Chester J. Szwejkowski, Ashutosh Giri, Patrick E. Hopkins
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. May 2018, 140(5): 052801.
Paper No: HT-17-1363
https://doi.org/10.1115/1.4038713
Published Online: February 6, 2018
View Articletitled, On the Steady-State Temperature Rise During Laser Heating of Multilayer Thin Films in Optical Pump–Probe Techniques
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Topics: Heating, Lasers, Probes, Pumps, Steady state, Temperature, Heat, Thin films, Transducers, Thermal conductivity
Journal Articles

Influence of Hot Electron Scattering and Electron–Phonon Interactions on Thermal Boundary Conductance at Metal/Nonmetal Interfaces

Ashutosh Giri, Brian M. Foley, Patrick E. Hopkins
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. September 2014, 136(9): 092401.
Paper No: HT-13-1565
https://doi.org/10.1115/1.4027785
Published Online: June 12, 2014
View Articletitled, Influence of Hot Electron Scattering and Electron–Phonon Interactions on Thermal Boundary Conductance at Metal/Nonmetal Interfaces
Open the PDF for Influence of Hot Electron Scattering and Electron–Phonon Interactions on Thermal Boundary Conductance at Metal/Nonmetal Interfaces in another window
Topics: Electrical conductance, Electrons, Metals, Nonmetallic materials, Phonons, Temperature, Probability, Electromagnetic scattering, Electron-phonon interactions, Absorption