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Journal Articles

Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects

Arman Nokhosteen, M. Soltani, Banafsheh Barabadi
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2019, 141(1): 011002.
Paper No: EP-18-1029
DOI: https://doi.org/10.1115/1.4041666
Published Online: February 25, 2019
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Topics: Boundary-value problems, Heat, Integrated circuits, Microelectronic devices, Modeling, Principal component analysis, Simulation, Temperature, Temperature distribution, Temperature profiles
Journal Articles

Transient Heat Conduction in On-Chip Interconnects Using Proper Orthogonal Decomposition Method

Banafsheh Barabadi, Satish Kumar, Yogendra K. Joshi
Journal: Journal of Heat Transfer
Article Type: Research-Article
J. Heat Transfer. July 2017, 139(7): 072101.
Paper No: HT-13-1223
DOI: https://doi.org/10.1115/1.4035889
Published Online: March 21, 2017
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Topics: Heat, Heating, Joules, Principal component analysis, Temperature, Transient heat transfer, Transients (Dynamics), Simulation, Microelectronic devices
Journal Articles

Controlled Wetting in Nanoporous Membranes for Thin Film Evaporation

Kyle L. Wilke, Banafsheh Barabadi, TieJun Zhang, Evelyn N. Wang
Journal: Journal of Heat Transfer
Article Type: Photo Gallery
J. Heat Transfer. August 2016, 138(8): 080906.
Paper No: HT-16-1272
DOI: https://doi.org/10.1115/1.4033827
Published Online: July 8, 2016
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Topics: Evaporation, Membranes, Thin films, Wetting, Floods, Liquid films, Aluminum, Capillarity, Cooling, Electronics
Journal Articles

Multiscale Transient Thermal Analysis of Microelectronics

Banafsheh Barabadi, Satish Kumar, Valeriy Sukharev, Yogendra K. Joshi
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031002.
Paper No: EP-13-1037
DOI: https://doi.org/10.1115/1.4029835
Published Online: September 1, 2015
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Topics: Microelectronic devices, Modeling, Simulation, Temperature, Thermal analysis, Transients (Dynamics), Temperature distribution
Proceedings Papers

Multi-Scale Transient Thermal Analysis of Microelectronics

Banafsheh Barabadi, Satish Kumar, Valeriy Sukharev, Yogendra K. Joshi
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 767-774, November 9–15, 2012
Paper No: IMECE2012-89864
DOI: https://doi.org/10.1115/IMECE2012-89864
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Topics: Microelectronic devices, Thermal analysis, Transients (Dynamics), Arches, Ball-Grid-Array packaging, Energy efficiency, Finite element analysis, Finite element model, Flip-chip, Flip-chip devices
Proceedings Papers

Rapid Transient Thermal Analysis of Three-Dimensional Interconnect Structures Using Proper Orthogonal Decomposition Method

Banafsheh Barabadi, Satish Kumar, Yogendra K. Joshi
Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 729-733, March 3–6, 2012
Paper No: MNHMT2012-75286
DOI: https://doi.org/10.1115/MNHMT2012-75286
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Topics: Principal component analysis, Thermal analysis, Transients (Dynamics), Heating, Joules, Architecture, Copper, Electrical wires, Metals, Modeling
Journal Articles

Interconnect Joule Heating under Transient Currents using the Transmission Line Matrix Method

Banafsheh Barabadi, Yogendra K. Joshi, Satish Kumar, Gamal Refai-Ahmed
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011009.
DOI: https://doi.org/10.1115/1.4006137
Published Online: March 21, 2012
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Topics: Heat, Heating, Joules, Temperature, Transients (Dynamics), Transmission lines, Steady state, Resistors, Currents, Simulation
Proceedings Papers

Prediction of Transient Thermal Behavior of Planar Interconnect Architecture Using Proper Orthogonal Decomposition Method

Banafsheh Barabadi, Yogendra K. Joshi, Satish Kumar
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 213-224, July 6–8, 2011
Paper No: IPACK2011-52133
DOI: https://doi.org/10.1115/IPACK2011-52133
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Topics: Principal component analysis, Transients (Dynamics), Heating, Integrated circuits, Joules, Microelectronic devices, Circuits, Failure, Fatigue failure, Finite element analysis
Proceedings Papers

Thermal Characterization of Planar Interconnect Architectures Under Transient Currents

Banafsheh Barabadi, Yogendra K. Joshi, Satish Kumar, Gamal Refai-Ahmed
Proc. ASME. IMECE2009, Volume 9: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B and C, 1381-1389, November 13–19, 2009
Paper No: IMECE2009-11996
DOI: https://doi.org/10.1115/IMECE2009-11996
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Topics: Architecture, Currents, Thermal characterization, Transients (Dynamics), Heating, Joules, Finite element analysis, Finite element model, Heat, Microelectronic devices
Proceedings Papers

Experimental and Computational Analysis of Brain Deformations in Linear Head Impact

Kurosh Darvish, Mehdi Shafieian, Kaveh Laksari, Banafsheh Barabadi, Cristina Parenti
Proc. ASME. IMECE2008, Volume 17: Transportation Systems, 117-124, October 31–November 6, 2008
Paper No: IMECE2008-69296
DOI: https://doi.org/10.1115/IMECE2008-69296
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Topics: Brain, Deformation, Finite element model, Pressure, Cerebrospinal fluid, Damping, Gelatin, Stress, Viscoelasticity, Wounds
Proceedings Papers

Lift Generation in Soft Porous Media Under Rapid Compaction

Banafsheh Barabadi, Rungun Nathan, Qianhong Wu
Proc. ASME. IMECE2008, Volume 10: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B, and C, 983-990, October 31–November 6, 2008
Paper No: IMECE2008-66639
DOI: https://doi.org/10.1115/IMECE2008-66639
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Topics: Compacting, Porous materials, Pressure, Compression, Damping, Pistons, Relaxation (Physics), Synthetic fibers, Accelerometers, Cylinders
Journal Articles

On the Characterization of Lifting Forces During the Rapid Compaction of Deformable Porous Media

Banafsheh Barabadi, Rungun Nathan, Kei-peng Jen, Qianhong Wu
Journal: Journal of Heat Transfer
Article Type: Research-Article
J. Heat Transfer. October 2009, 131(10): 101006.
DOI: https://doi.org/10.1115/1.3167543
Published Online: July 29, 2009
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Topics: Compacting, Compression, Damping, Displacement, Fibers, Permeability, Pistons, Porous materials, Pressure, Cylinders