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Journal Articles

Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects

Arman Nokhosteen, M. Soltani, Banafsheh Barabadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2019, 141(1): 011002.
Paper No: EP-18-1029
https://doi.org/10.1115/1.4041666
Published Online: February 25, 2019
View Article titled, Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects
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Topics: Boundary-value problems, Heat, Integrated circuits, Microelectronic devices, Modeling, Principal component analysis, Simulation, Temperature, Temperature distribution, Temperature profiles
Journal Articles

Transient Heat Conduction in On-Chip Interconnects Using Proper Orthogonal Decomposition Method

Banafsheh Barabadi, Satish Kumar, Yogendra K. Joshi
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. July 2017, 139(7): 072101.
Paper No: HT-13-1223
https://doi.org/10.1115/1.4035889
Published Online: March 21, 2017
View Article titled, Transient Heat Conduction in On-Chip Interconnects Using Proper Orthogonal Decomposition Method
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Topics: Heat, Heating, Joules, Principal component analysis, Temperature, Transient heat transfer, Transients (Dynamics), Simulation, Microelectronic devices
Journal Articles

Controlled Wetting in Nanoporous Membranes for Thin Film Evaporation

Kyle L. Wilke, Banafsheh Barabadi, TieJun Zhang, Evelyn N. Wang
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Photo Gallery
J. Heat Mass Transfer. August 2016, 138(8): 080906.
Paper No: HT-16-1272
https://doi.org/10.1115/1.4033827
Published Online: July 8, 2016
View Article titled, Controlled Wetting in Nanoporous Membranes for Thin Film Evaporation
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Topics: Evaporation, Membranes, Thin films, Wetting, Floods, Liquid films, Aluminum, Capillarity, Cooling, Electronics
Journal Articles

Multiscale Transient Thermal Analysis of Microelectronics

Banafsheh Barabadi, Satish Kumar, Valeriy Sukharev, Yogendra K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031002.
Paper No: EP-13-1037
https://doi.org/10.1115/1.4029835
Published Online: September 1, 2015
View Article titled, Multiscale Transient Thermal Analysis of Microelectronics
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Topics: Microelectronic devices, Modeling, Simulation, Temperature, Thermal analysis, Transients (Dynamics), Temperature distribution
Proceedings Papers

Multi-Scale Transient Thermal Analysis of Microelectronics

Banafsheh Barabadi, Satish Kumar, Valeriy Sukharev, Yogendra K. Joshi
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 767-774, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-89864
https://doi.org/10.1115/IMECE2012-89864
View Paper titled, Multi-Scale Transient Thermal Analysis of Microelectronics
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Topics: Microelectronic devices, Thermal analysis, Transients (Dynamics), Arches, Ball-Grid-Array packaging, Energy efficiency, Finite element analysis, Finite element model, Flip-chip, Flip-chip devices
Proceedings Papers

Rapid Transient Thermal Analysis of Three-Dimensional Interconnect Structures Using Proper Orthogonal Decomposition Method

Banafsheh Barabadi, Satish Kumar, Yogendra K. Joshi
Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 729-733, March 3–6, 2012
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2012-75286
https://doi.org/10.1115/MNHMT2012-75286
View Paper titled, Rapid Transient Thermal Analysis of Three-Dimensional Interconnect Structures Using Proper Orthogonal Decomposition Method
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Topics: Principal component analysis, Thermal analysis, Transients (Dynamics), Heating, Joules, Architecture, Copper, Electrical wires, Metals, Modeling
Journal Articles

Interconnect Joule Heating under Transient Currents using the Transmission Line Matrix Method

Banafsheh Barabadi, Yogendra K. Joshi, Satish Kumar, Gamal Refai-Ahmed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011009.
https://doi.org/10.1115/1.4006137
Published Online: March 21, 2012
View Article titled, Interconnect Joule Heating under Transient Currents using the Transmission Line Matrix Method
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Topics: Heat, Heating, Joules, Temperature, Transients (Dynamics), Transmission lines, Steady state, Resistors, Currents, Simulation
Proceedings Papers

Prediction of Transient Thermal Behavior of Planar Interconnect Architecture Using Proper Orthogonal Decomposition Method

Banafsheh Barabadi, Yogendra K. Joshi, Satish Kumar
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 213-224, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52133
https://doi.org/10.1115/IPACK2011-52133
View Paper titled, Prediction of Transient Thermal Behavior of Planar Interconnect Architecture Using Proper Orthogonal Decomposition Method
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Topics: Principal component analysis, Transients (Dynamics), Heating, Integrated circuits, Joules, Microelectronic devices, Circuits, Failure, Fatigue failure, Finite element analysis
Proceedings Papers

Thermal Characterization of Planar Interconnect Architectures Under Transient Currents

Banafsheh Barabadi, Yogendra K. Joshi, Satish Kumar, Gamal Refai-Ahmed
Proc. ASME. IMECE2009, Volume 9: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B and C, 1381-1389, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11996
https://doi.org/10.1115/IMECE2009-11996
View Paper titled, Thermal Characterization of Planar Interconnect Architectures Under Transient Currents
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Topics: Architecture, Currents, Thermal characterization, Transients (Dynamics), Heating, Joules, Finite element analysis, Finite element model, Heat, Microelectronic devices
Proceedings Papers

Lift Generation in Soft Porous Media Under Rapid Compaction

Banafsheh Barabadi, Rungun Nathan, Qianhong Wu
Proc. ASME. IMECE2008, Volume 10: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B, and C, 983-990, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-66639
https://doi.org/10.1115/IMECE2008-66639
View Paper titled, Lift Generation in Soft Porous Media Under Rapid Compaction
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Topics: Compacting, Porous materials, Pressure, Compression, Damping, Pistons, Relaxation (Physics), Synthetic fibers, Accelerometers, Cylinders
Proceedings Papers

Experimental and Computational Analysis of Brain Deformations in Linear Head Impact

Kurosh Darvish, Mehdi Shafieian, Kaveh Laksari, Banafsheh Barabadi, Cristina Parenti
Proc. ASME. IMECE2008, Volume 17: Transportation Systems, 117-124, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-69296
https://doi.org/10.1115/IMECE2008-69296
View Paper titled, Experimental and Computational Analysis of Brain Deformations in Linear Head Impact
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Topics: Brain, Deformation, Finite element model, Pressure, Cerebrospinal fluid, Damping, Gelatin, Stress, Viscoelasticity, Wounds
Journal Articles

On the Characterization of Lifting Forces During the Rapid Compaction of Deformable Porous Media

Banafsheh Barabadi, Rungun Nathan, Kei-peng Jen, Qianhong Wu
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. October 2009, 131(10): 101006.
https://doi.org/10.1115/1.3167543
Published Online: July 29, 2009
View Article titled, On the Characterization of Lifting Forces During the Rapid Compaction of Deformable Porous Media
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Topics: Compacting, Compression, Damping, Displacement, Fibers, Permeability, Pistons, Porous materials, Pressure, Cylinders