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D. Bhate
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Journal Articles

Singularities at Solder Joint Interfaces and Their Effects on Fracture Models

D. Bhate, D. Chan, G. Subbarayan, L. Nguyen, J. Zhao, D. Edwards
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021007.
https://doi.org/10.1115/1.4001588
Published Online: June 25, 2010
View Article titled, Singularities at Solder Joint Interfaces and Their Effects on Fracture Models
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Topics: Fracture (Materials), Stress, Solder joints, Finite element analysis
Journal Articles

Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical Fits

D. Bhate, G. Subbarayan, J. Zhao, V. Gupta, D. Edwards
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2009, 131(4): 044502.
https://doi.org/10.1115/1.4000208
Published Online: November 12, 2009
View Article titled, Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical Fits
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Topics: Geometry, Solder joints, Solders, Failure, Fatigue, Alloys, Energy dissipation
Proceedings Papers

Constitutive Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Alloys at Creep and Low Strain Rate Regimes

D. Bhate, D. Chan, G. Subbarayan, T. C. Chiu, V. Gupta, D. Edwards
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 183-196, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-44151
https://doi.org/10.1115/IMECE2007-44151
View Paper titled, Constitutive Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Alloys at Creep and Low Strain Rate Regimes
Open the PDF for Constitutive Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Alloys at Creep and Low Strain Rate Regimes in another window
Topics: Alloys, Creep, Solders, Constitutive equations, Lead-free solders, Stress, Modeling, Temperature, Deformation, Errors
Journal Articles

A Nonlinear Fracture Mechanics Approach to Modeling Fatigue Crack Growth in Solder Joints

D. Bhate, D. Chan, G. Subbarayan, L. Nguyen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021003.
https://doi.org/10.1115/1.2840057
Published Online: April 15, 2008
View Article titled, A Nonlinear Fracture Mechanics Approach to Modeling Fatigue Crack Growth in Solder Joints
Open the PDF for A Nonlinear Fracture Mechanics Approach to Modeling Fatigue Crack Growth in Solder Joints in another window
Topics: Fatigue, Fatigue cracks, Fracture (Materials), Fracture mechanics, Modeling, Solder joints, Solders, Tin, Damage, Creep