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Proceedings Papers

The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints

Y. Li, R. L. Mahajan, G. Subbarayan
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 119-129, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0782
https://doi.org/10.1115/IMECE1996-0782
View Paper titled, The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints
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Topics: Optimization, Printing, Reliability, Solder joints, Solders, Ball-Grid-Array packaging, Ceramics, Fatigue life, Cycles, Design
Proceedings Papers

A Method for Comparative Performance Evaluation of Structural Optimization Codes: Part II — Applications

G. Subbarayan, D. L. Bartel, D. L. Taylor
Proc. ASME. DETC88, 14th Design Automation Conference, 227-232, September 25–28, 1988
Publisher: American Society of Mechanical Engineers
Paper No: DETC1988-0029
https://doi.org/10.1115/DETC1988-0029
View Paper titled, A Method for Comparative Performance Evaluation of Structural Optimization Codes: Part II — Applications
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Topics: Performance evaluation, Structural optimization, Nonlinear programming, Design, Optimization
Proceedings Papers

A Method for Comparative Performance Evaluation of Structural Optimization Codes: Part I — Theory

G. Subbarayan, D. L. Bartel, D. L. Taylor
Proc. ASME. DETC88, 14th Design Automation Conference, 221-225, September 25–28, 1988
Publisher: American Society of Mechanical Engineers
Paper No: DETC1988-0028
https://doi.org/10.1115/DETC1988-0028
View Paper titled, A Method for Comparative Performance Evaluation of Structural Optimization Codes: Part I — Theory
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Topics: Performance evaluation, Structural optimization, Nonlinear programming, Design, Optimization
Journal Articles

An Improved Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials

B. Dan, B. G. Sammakia, G. Subbarayan, S. Kanuparthi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 031003.
Paper No: EP-12-1098
https://doi.org/10.1115/1.4024392
Published Online: June 4, 2013
View Article titled, An Improved Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials
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Topics: Particulate matter, Thermal conductivity, Electrical conductance, Network models, Approximation
Proceedings Papers

Mechanistic Model for Aging Influenced Steady State Flow Behavior of Sn3.8Ag0.7Cu Solder Alloys

K. Mysore, S. Chavali, D. Chan, G. Subbarayan, I. Dutta, V. Gupta, D. Edwards
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 443-450, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89401
https://doi.org/10.1115/InterPACK2009-89401
View Paper titled, Mechanistic Model for Aging Influenced Steady State Flow Behavior of Sn3.8Ag0.7Cu Solder Alloys
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Topics: Alloys, Flow (Dynamics), Solders, Steady state, Creep, Temperature, Plasticity, Stress, Geometry, Shear (Mechanics)
Journal Articles

Singularities at Solder Joint Interfaces and Their Effects on Fracture Models

D. Bhate, D. Chan, G. Subbarayan, L. Nguyen, J. Zhao, D. Edwards
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021007.
https://doi.org/10.1115/1.4001588
Published Online: June 25, 2010
View Article titled, Singularities at Solder Joint Interfaces and Their Effects on Fracture Models
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Topics: Fracture (Materials), Stress, Solder joints, Finite element analysis
Journal Articles

Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical Fits

D. Bhate, G. Subbarayan, J. Zhao, V. Gupta, D. Edwards
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2009, 131(4): 044502.
https://doi.org/10.1115/1.4000208
Published Online: November 12, 2009
View Article titled, Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical Fits
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Topics: Geometry, Solder joints, Solders, Failure, Fatigue, Alloys, Energy dissipation
Proceedings Papers

Constitutive Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Alloys at Creep and Low Strain Rate Regimes

D. Bhate, D. Chan, G. Subbarayan, T. C. Chiu, V. Gupta, D. Edwards
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 183-196, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-44151
https://doi.org/10.1115/IMECE2007-44151
View Paper titled, Constitutive Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Alloys at Creep and Low Strain Rate Regimes
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Topics: Alloys, Creep, Solders, Constitutive equations, Lead-free solders, Stress, Modeling, Temperature, Deformation, Errors
Proceedings Papers

High Resolution Characterization of Materials Used in Packages Through Digital Image Correlation

V. Srinivasan, S. Radhakrishnan, X. Zhang, G. Subbarayan, T. Baughn, L. Nguyen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1471-1478, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73258
https://doi.org/10.1115/IPACK2005-73258
View Paper titled, High Resolution Characterization of Materials Used in Packages Through Digital Image Correlation
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Topics: Materials characterization, Resolution (Optics), Composite materials, Computer software, Displacement, B-splines, Fibers, High temperature, Mechanical testing, Packaging
Proceedings Papers

Hierarchical Modeling and Trade-Off Studies in Design of Thermal Interface Materials

X. Zhang, S. Kanuparthi, G. Subbarayan, B. Sammakia, S. Tonapi
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1479-1486, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73259
https://doi.org/10.1115/IPACK2005-73259
View Paper titled, Hierarchical Modeling and Trade-Off Studies in Design of Thermal Interface Materials
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Topics: Design, Modeling, Tradeoffs, Particulate matter, Flat heat pipes, Thermal conductivity, Computer cooling, Fillers (Materials), Heat sinks, Percolation theory
Journal Articles

Thermal Solution Maps: A Strategy for Thermal Design of Three-Dimensional Packages

M. Rayasam, S. Chaparala, D. Farnam, B. G. Sammakia, G. Subbarayan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011015.
https://doi.org/10.1115/1.3077131
Published Online: February 25, 2009
View Article titled, Thermal Solution Maps: A Strategy for Thermal Design of Three-Dimensional Packages
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Topics: Design, Microchannels, Optimization, Heat
Proceedings Papers

Molecular Dynamics Simulations of Nanotube-Polymer Composites for Use as Thermal Interface Material

S. Mahajan, G. Subbarayan, B. G. Sammakia, W. Jones
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 381-385, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42462
https://doi.org/10.1115/IMECE2003-42462
View Paper titled, Molecular Dynamics Simulations of Nanotube-Polymer Composites for Use as Thermal Interface Material
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Topics: Composite materials, Molecular dynamics simulation, Nanotubes, Polymers, Thermal conductivity, Carbon nanotubes, Microelectronic devices, Thermal management, Bonding, Carbon
Journal Articles

A Nonlinear Fracture Mechanics Approach to Modeling Fatigue Crack Growth in Solder Joints

D. Bhate, D. Chan, G. Subbarayan, L. Nguyen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021003.
https://doi.org/10.1115/1.2840057
Published Online: April 15, 2008
View Article titled, A Nonlinear Fracture Mechanics Approach to Modeling Fatigue Crack Growth in Solder Joints
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Topics: Fatigue, Fatigue cracks, Fracture (Materials), Fracture mechanics, Modeling, Solder joints, Solders, Tin, Damage, Creep
Proceedings Papers

Stochastic Characterization of Epoxies to Predict Performance Uncertainty of Photonic Packages

S. Radhakrishnan, G. Subbarayan, L. Nguyen, W. Mazotti
Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 211-218, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-61846
https://doi.org/10.1115/IMECE2004-61846
View Paper titled, Stochastic Characterization of Epoxies to Predict Performance Uncertainty of Photonic Packages
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Topics: Epoxy adhesives, Epoxy resins, Uncertainty, Geometry, Viscoelasticity, Displacement, Photonic systems, Ultraviolet radiation
Journal Articles

Stochastic Characterization and Models to Predict Performance Uncertainty in Photonic Packages

S. Radhakrishnan, G. Subbarayan, L. Nguyen, W. Mazotti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 229–235.
https://doi.org/10.1115/1.2753885
Published Online: October 22, 2006
View Article titled, Stochastic Characterization and Models to Predict Performance Uncertainty in Photonic Packages
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Topics: Epoxy adhesives, Epoxy resins, Uncertainty, Viscoelasticity, Temperature, Modeling, Lasers, Displacement
Journal Articles

LGA Connectors: An Automated Design Technique for a Shrinking Design Space

A. Deshpande, G. Subbarayan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 247–254.
https://doi.org/10.1115/1.1286021
Published Online: September 1, 2000
View Article titled, LGA Connectors: An Automated Design Technique for a Shrinking Design Space
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Topics: Design, Optimization, Shapes, Stress, Finite element analysis, B-splines
Journal Articles

A Reconciliation of Local and Global Models for Bone Remodeling Through Optimization Theory

G. Subbarayan, Associate Professor,, D. L. Bartel, Professor,
Journal: Journal of Biomechanical Engineering
Publisher: ASME
Article Type: Technical Papers
J Biomech Eng. February 2000, 122(1): 72–76.
https://doi.org/10.1115/1.429633
Published Online: September 1, 1999
View Article titled, A Reconciliation of Local and Global Models for Bone Remodeling Through Optimization Theory
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Topics: Bone, Density, Optimization, Stress, Shapes
Journal Articles

A Two-Body Formulation for Solder Joint Shape Prediction

F. P. Renken, G. Subbarayan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 302–308.
https://doi.org/10.1115/1.2792637
Published Online: September 1, 1998
View Article titled, A Two-Body Formulation for Solder Joint Shape Prediction
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Topics: Shapes, Solder joints, Solders, Drops, Ball-Grid-Array packaging, Ceramics, Design, Fatigue life, Finite element analysis, Flip-chip
Journal Articles

The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints

Y. Li, R. L. Mahajan, G. Subbarayan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 54–60.
https://doi.org/10.1115/1.2792286
Published Online: March 1, 1998
View Article titled, The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints
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Topics: Optimization, Printing, Reliability, Solder joints, Solders, Ball-Grid-Array packaging, Ceramics, Fatigue life, Cycles, Design
Journal Articles

The Impact of Interfacial Adhesion on PTH and Via Stress State

G. Subbarayan, K. Ramakrishna, B. G. Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 260–267.
https://doi.org/10.1115/1.2792247
Published Online: December 1, 1997
View Article titled, The Impact of Interfacial Adhesion on PTH and Via Stress State
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Topics: Adhesion, Stress, Laminates, Fracture (Materials), Fracture (Process), Plating, Drills (Tools), Finite element analysis, Junctions, Manufacturing