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Guo-Quan Lu
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Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A006, October 7–9, 2019
Paper No: IPACK2019-6393
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, August 27–30, 2018
Paper No: IPACK2018-8276
Journal Articles
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041003.
Published Online: August 29, 2012
Topics: Lasers, Bonding
Journal Articles
Proceedings Papers

Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 247-256, November 15–21, 2003
Paper No: IMECE2003-41993
Proceedings Papers

Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 415-424, November 5–11, 2005
Paper No: IMECE2005-79187
Journal Articles