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H. Yeung
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Proceedings Papers
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 69-72, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24708
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Energy Resour. Technol. September 2012, 134(3): 034501.
Published Online: May 7, 2012
Journal Articles
Journal:
Journal of Fluids Engineering
Publisher: ASME
Article Type: Research Papers
J. Fluids Eng. February 2010, 132(2): 021201.
Published Online: February 3, 2010
Journal Articles
Journal:
Journal of Vibration and Acoustics
Publisher: ASME
Article Type: Technical Briefs
J. Vib. Acoust. December 2009, 131(6): 064501.
Published Online: November 18, 2009
Journal Articles
Journal:
Journal of Fluids Engineering
Publisher: ASME
Article Type: Technical Papers
J. Fluids Eng. May 2004, 126(3): 355–361.
Published Online: July 12, 2004
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2003, 125(4): 624–629.
Published Online: December 15, 2003
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 93–97.
Published Online: March 14, 2003
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 374–378.
Published Online: December 12, 2002
Journal Articles
Journal:
Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. March 1998, 65(1): 164–170.
Published Online: March 1, 1998