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Hung-Jue Sue
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Proceedings Papers

Toughening of High Performance Epoxy Adhesives Using Core-Shell Particles

Hung-Jue Sue, P. Mac Puckett, Yee Y. Wang
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 163-168, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0512
https://doi.org/10.1115/IMECE1997-0512
View Paper titled, Toughening of High Performance Epoxy Adhesives Using Core-Shell Particles
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Topics: Epoxy adhesives, Particulate matter, Shells, Rubber, Adhesives, Elastic moduli, Fracture toughness, Glass transition, Materials properties, Shear (Mechanics)
Journal Articles

The Effect of Nanoparticle Functionalization on Lubrication Performance of Nanofluids Dispersing Silica Nanoparticles in an Ionic Liquid

Cengiz Yegin, Wei Lu, Bassem Kheireddin, Ming Zhang, Peng Li, Younjin Min, Hung-Jue Sue, Mufrettin Murat Sari, Mustafa Akbulut
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research-Article
J. Tribol. July 2017, 139(4): 041802.
Paper No: TRIB-16-1180
https://doi.org/10.1115/1.4035342
Published Online: April 4, 2017
View Article titled, The Effect of Nanoparticle Functionalization on Lubrication Performance of Nanofluids Dispersing Silica Nanoparticles in an Ionic Liquid
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Topics: Friction, Nanoparticles, Wear, Lubrication, Rheology
Proceedings Papers

Integrity of 3LPE Pipeline Coatings: Residual Stresses and Adhesion Degradation

Benjamin T. A. Chang, Hung-Jue Sue, Han Jiang, Bobby Browning, Dennis Wong, Ha Pham, Shu Guo, Al Kehr, Meghan Mallozzi, William Snider, Al Siegmund
Proc. ASME. IPC2008, 2008 7th International Pipeline Conference, Volume 2, 75-86, September 29–October 3, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IPC2008-64048
https://doi.org/10.1115/IPC2008-64048
View Paper titled, Integrity of 3LPE Pipeline Coatings: Residual Stresses and Adhesion Degradation
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Topics: Adhesion, Coatings, Pipelines, Residual stresses, Stress, Construction, Damage, Epoxy adhesives, Epoxy resins, Hot water
Journal Articles

On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials

Yoonchan Oh, C. Steve Suh, Hung-Jue Sue
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021009.
https://doi.org/10.1115/1.2912209
Published Online: May 9, 2008
View Article titled, On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials
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Topics: Damage, Epoxy resins, Failure mechanisms, Flip-chip, Flip-chip devices, Reliability, Solder joints, Solders, Viscoelasticity, Waves
Journal Articles

On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion

Yoonchan Oh, C. Steve Suh, Hung-Jue Sue
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021008.
https://doi.org/10.1115/1.2912188
Published Online: May 9, 2008
View Article titled, On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion
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Topics: Damage, Failure, Failure mechanisms, Flip-chip devices, High cycle fatigue, Power density, Solders, Stress, Thermal expansion, Wave motion