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Journal Articles

Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms

Aastha Uppal, Jerrod Peterson, Je-Young Chang, Xi Guo, Frank Liang, Weihua Tang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2019, 141(1): 010803.
Paper No: EP-18-1053
https://doi.org/10.1115/1.4042801
Published Online: March 4, 2019
View Article titled, Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms
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Topics: Design, Modeling, Thermomechanics, Stress, Heat pipes, Pressure
Proceedings Papers

Compact Thermal Modeling Methodology for Active and Thermal Bumps in 3D Microelectronic Packages

Arnab Choudhury, Shrenik Kothari, Nayandeep Mahanta, Hemanth Dhavaleswarapu, Je-Young Chang
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A067, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48104
https://doi.org/10.1115/IPACK2015-48104
View Paper titled, Compact Thermal Modeling Methodology for Active and Thermal Bumps in 3D Microelectronic Packages
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Topics: Modeling, Thermal conductivity, Design, Heat transfer, Junctions, Reliability, Temperature, Thermal resistance
Journal Articles

Enhanced Heat Transfer in Biporous Wicks in the Thin Liquid Film Evaporation and Boiling Regimes

Dušan Ćoso, Vinod Srinivasan, Ming-Chang Lu, Je-Young Chang, Arun Majumdar
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Evaporation, Boiling, and Condensation
J. Heat Mass Transfer. October 2012, 134(10): 101501.
https://doi.org/10.1115/1.4006106
Published Online: August 7, 2012
View Article titled, Enhanced Heat Transfer in Biporous Wicks in the Thin Liquid Film Evaporation and Boiling Regimes
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Topics: Boiling, Evaporation, Flux (Metallurgy), Heat, Heat flux, Heat transfer, Heat transfer coefficients, Lubrication theory, Microchannels, Vapors
Proceedings Papers

Cooling of Electronic Chips Using Microchannel and Micro-Pin Fin Heat Exchangers

Ravi Prasher, Je-Young Chang
Proc. ASME. ICNMM2008, ASME 2008 6th International Conference on Nanochannels, Microchannels, and Minichannels, 1881-1887, June 23–25, 2008
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2008-62384
https://doi.org/10.1115/ICNMM2008-62384
View Paper titled, Cooling of Electronic Chips Using Microchannel and Micro-Pin Fin Heat Exchangers
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Topics: Cooling, Heat exchangers, Microchannels, Microscale devices, Computer cooling, Design, Electronic systems, Integrated circuits, Microparticles, Nanomaterials
Proceedings Papers

High-Speed Visualization of Phase-Change Processes in Silicon Microchannels With Water and HFE-7100 as Working Fluids

Tao Tong, Je-Young Chang, Shankar Devasenathipathy, John Dirner, Suzana Prstic, Ravi Prasher
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 111-120, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-42028
https://doi.org/10.1115/IMECE2007-42028
View Paper titled, High-Speed Visualization of Phase-Change Processes in Silicon Microchannels With Water and HFE-7100 as Working Fluids
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Topics: Fluids, Microchannels, Silicon, Visualization, Water, Flow (Dynamics), Evaporation, Heat flux, Boiling, Density
Proceedings Papers

Performances of Silicon Micro-Flow-Passage Cold Plates From Single-Phase to Two-Phase With Water and HFE-7100 as Working Fluids

Tao Tong, Je-Young Chang, Shankar Devasenathipathy, John Dirner, Suzana Prstic, Ravi Prasher
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 95-110, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-42027
https://doi.org/10.1115/IMECE2007-42027
View Paper titled, Performances of Silicon Micro-Flow-Passage Cold Plates From Single-Phase to Two-Phase With Water and HFE-7100 as Working Fluids
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Topics: Flow (Dynamics), Fluids, Plates (structures), Silicon, Water, Boiling, Design, Microchannels, Pressure, Visualization
Proceedings Papers

Thermal Resistance and Pressure Drop of Silicon Based Micro Pin Fin Heat Exchanger Under Cross Flow

Ravi S. Prasher, John Dirner, Je-Young Chang, Alan Myers, David Chau, Dongming He, Suzana Prstic
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 717-725, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73086
https://doi.org/10.1115/IPACK2005-73086
View Paper titled, Thermal Resistance and Pressure Drop of Silicon Based Micro Pin Fin Heat Exchanger Under Cross Flow
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Topics: Cross-flow, Heat exchangers, Pressure drop, Silicon, Thermal resistance, Dimensions, Fins, Fluids, Friction, Pins (Engineering)
Proceedings Papers

Effect of Localized Hotspot on the Thermal Performance of Two-Phase Microchannel Heat Exchanger

Ravi S. Prasher, John Dirner, Je-Young Chang, Alan Myers, David Chau, Suzana Prstic, Dongming He
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 99-103, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73087
https://doi.org/10.1115/IPACK2005-73087
View Paper titled, Effect of Localized Hotspot on the Thermal Performance of Two-Phase Microchannel Heat Exchanger
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Topics: Heat exchangers, Microchannels, Heating, Boiling, Cooling, Heat, Heat transfer, Temperature sensors, Wall temperature
Proceedings Papers

Thermal Performance and Key Challenges for Future CPU Cooling Technologies

Ioan Sauciuc, Ravi Prasher, Je-Young Chang, Hakan Erturk, Gregory Chrysler, Chia-Pin Chiu, Ravi Mahajan
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 353-364, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73242
https://doi.org/10.1115/IPACK2005-73242
View Paper titled, Thermal Performance and Key Challenges for Future CPU Cooling Technologies
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Topics: Blocks (Building materials), Boundary-value problems, Computer cooling, Cooling, Density, Design, Electrical conductivity, Heat pipes, Heat transfer, Industrial research
Proceedings Papers

Thermal Performance of Vapor Chambers Under Hot Spot Heating Conditions

Je-Young Chang, Unnikrishnan Vadakkan, Ravi Prasher, Suzana Prstic
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 197-203, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73131
https://doi.org/10.1115/IPACK2005-73131
View Paper titled, Thermal Performance of Vapor Chambers Under Hot Spot Heating Conditions
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Topics: Heating, Vapors, Copper, Boundary-value problems, Cooling, Heat, Heat conduction, Heat flux, Heat pipes, Heat transfer
Proceedings Papers

Convective Performance of Package Based Single Phase Microchannel Heat Exchanger

Je-Young Chang, Ravi Prasher, David Chau, Alan Myers, John Dirner, Suzana Prstic, Dongming He
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 183-188, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73126
https://doi.org/10.1115/IPACK2005-73126
View Paper titled, Convective Performance of Package Based Single Phase Microchannel Heat Exchanger
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Topics: Heat exchangers, Microchannels, Heating, Temperature sensors, Cooling, Fluids, Heat flux, Heat transfer, Integrated circuits, Junctions
Journal Articles

Evaporative Thermal Performance of Vapor Chambers Under Nonuniform Heating Conditions

Je-Young Chang, Ravi S. Prasher, Suzana Prstic, P. Cheng, H. B. Ma
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. December 2008, 130(12): 121501.
https://doi.org/10.1115/1.2976786
Published Online: September 23, 2008
View Article titled, Evaporative Thermal Performance of Vapor Chambers Under Nonuniform Heating Conditions
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Topics: Copper, Heat flux, Heating, Silicon, Vapors, Thermal resistance, Heat, Heat pipes
Proceedings Papers

New Electrochemical Cell Designs and Test Methods for Corrosion Testing of the Components in Integrated Circuit Liquid Cooling Systems

Je-Young Chang, Choong-Un Kim, Nancy Michael, Balu Pathangey, Paul Gwin, Ravi Prasher
Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 257-265, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-15223
https://doi.org/10.1115/IMECE2006-15223
View Paper titled, New Electrochemical Cell Designs and Test Methods for Corrosion Testing of the Components in Integrated Circuit Liquid Cooling Systems
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Topics: Cooling systems, Corrosion, Electrochemical cells, Integrated circuits, Testing, Electrodes, Graphite, Cavities, Computers, Data acquisition
Proceedings Papers

Nusselt Number and Friction Factor of Staggered Arrays of Low Aspect Ratio Micro-Pin-Fins Under Cross Flow for Water as Fluid

Ravi S. Prasher, John Dirner, Je-Young Chang, Alan Myers, David Chau, Dongming He, Suzana Prstic
Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 9-20, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-13140
https://doi.org/10.1115/IMECE2006-13140
View Paper titled, Nusselt Number and Friction Factor of Staggered Arrays of Low Aspect Ratio Micro-Pin-Fins Under Cross Flow for Water as Fluid
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Topics: Cross-flow, Fins, Fluids, Friction, Water, Plates (structures), Reynolds number, Dimensions, Pins (Engineering), Shapes
Proceedings Papers

Performance of Two-Phase Microchannels at Sub-Atmospheric Pressure

Tao Tong, Shankar Devasenathipathy, Je-Young Chang, John Dirner, Suzana Prstic, Ravi S. Prasher
Proc. ASME. IMECE2006, Heat Transfer, Volume 2, 183-192, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-13144
https://doi.org/10.1115/IMECE2006-13144
View Paper titled, Performance of Two-Phase Microchannels at Sub-Atmospheric Pressure
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Topics: Microchannels, Pressure, Flow (Dynamics), Boiling, Pressure drop, Water temperature, Cooling, Fluids, Heat, Heat transfer
Journal Articles

Nusselt Number and Friction Factor of Staggered Arrays of Low Aspect Ratio Micropin-Fins Under Cross Flow for Water as Fluid

Ravi S. Prasher, John Dirner, Je-Young Chang, Alan Myers, David Chau, Dongming He, Suzana Prstic
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 2007, 129(2): 141–153.
https://doi.org/10.1115/1.2402179
Published Online: April 13, 2006
View Article titled, Nusselt Number and Friction Factor of Staggered Arrays of Low Aspect Ratio Micropin-Fins Under Cross Flow for Water as Fluid
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Topics: Cross-flow, Fins, Fluids, Friction, Pins (Engineering), Plates (structures), Thermal resistance, Water, Flow (Dynamics), Temperature sensors