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Jie Wei
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Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 107-111, July 6–8, 2011
Paper No: IPACK2011-52045
Proceedings Papers

Proc. ASME. IPC2008, 2008 7th International Pipeline Conference, Volume 1, 509-516, September 29–October 3, 2008
Paper No: IPC2008-64115
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 445-450, July 17–22, 2005
Paper No: IPACK2005-73293
Topics: Cooling
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 469-475, July 17–22, 2005
Paper No: IPACK2005-73313
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 97-102, July 6–11, 2003
Paper No: IPACK2003-35041