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Julien Sylvestre
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Journal Articles

Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Wei Tong, Alireza Ganjali, Omidreza Ghaffari, Chady al Sayed, Luc Fréchette, Julien Sylvestre
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041011.
Paper No: EP-21-1119
DOI: https://doi.org/10.1115/1.4053310
Published Online: January 28, 2022
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Topics: Boiling, Cooling, Heat, Heat transfer coefficients, Temperature, Critical heat flux, Temperature distribution, Flat heat pipes
Journal Articles

Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Omidreza Ghaffari, Wei Tong, Yaser Nabavi Larimi, Chady al Sayed, Alireza Ganjali, Jean-François Morissette, Francis Grenier, Simon Jasmin, Luc Fréchette, Julien Sylvestre
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041103.
Paper No: EP-21-1083
DOI: https://doi.org/10.1115/1.4051943
Published Online: August 27, 2021
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Topics: Boiling, Cooling, Dielectric liquids, Heat, Temperature, Copper, Flat heat pipes, Pool boiling, Critical heat flux, Subcooling
Journal Articles

Passive Alignment Method for the Bonding of Flat Surfaces Using a Squeeze Flow

Willy Lecarpentier, Julien Sylvestre
Journal: Journal of Applied Mechanics
Article Type: Research-Article
J. Appl. Mech. September 2019, 86(9): 091009.
Paper No: JAM-19-1130
DOI: https://doi.org/10.1115/1.4043911
Published Online: June 27, 2019
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Topics: Bonding, Computational fluid dynamics, Flow (Dynamics), Fluids, Manufacturing, Plates (structures), Pressure, Torque, Bending (Stress)
Proceedings Papers

Large-Scale Model of Flip-Chip Joining Defects

Julien Sylvestre, Maud Samson, Éric Duchesne, Dominique Langlois-Demers
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A065, November 14–20, 2014
Paper No: IMECE2014-36744
DOI: https://doi.org/10.1115/IMECE2014-36744
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Topics: Flip-chip, Joining, Solders, Bridges (Structures), Computer simulation, Delays, Dynamics (Mechanics), Surface energy, Temperature, Thermal expansion