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Proceedings Papers

Development of a Program for Predicting Residual Stress Distribution in Multi-Stacked Film

Hyeon Chang Choi, Jun Hyub Park, Yong Soo Park

Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 311-317, November 11–16, 2001

Publisher: American Society of Mechanical Engineers

Paper No: IMECE2001/MEMS-23845

https://doi.org/10.1115/IMECE2001/MEMS-23845

View Paper titled, Development of a Program for Predicting Residual Stress Distribution in Multi-Stacked Film

Topics: Microelectromechanical systems, Stress concentration, Finite element methods, Semiconductor wafers, Deflection, Stress, Cantilever beams, Finite element analysis, Microcantilevers, Micromachining

Proceedings Papers

Image-Based Displacement Measurement System for the Characterization of Mechanical Properties of Thin Films

Jong-Eun Ha, Jun-Hyub Park, Joong-Hyok An, Yun-Jae Kim

Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 1649-1653, January 10–13, 2007

Publisher: American Society of Mechanical Engineers

Paper No: MNC2007-21570

https://doi.org/10.1115/MNC2007-21570

View Paper titled, Image-Based Displacement Measurement System for the Characterization of Mechanical Properties of Thin Films

Topics: Displacement measurement, Mechanical properties, Microelectromechanical systems, Thin films

Proceedings Papers

Reliability Assessment of MEMS Structure of Su-8 Thin Film

Jun-Hyub Park, Joong-Hyok An, Yun-Jae Kim, Hak-Joo Lee, Hee Yuel Roh, Sang-Hyun Kim

Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 495-500, January 10–13, 2007

Publisher: American Society of Mechanical Engineers

Paper No: MNC2007-21306

https://doi.org/10.1115/MNC2007-21306

View Paper titled, Reliability Assessment of MEMS Structure of Su-8 Thin Film

Topics: Microelectromechanical systems, Reliability, Thin films, Stress, Mechanical properties, Durability, Brittleness, Dimensions, Evaluation methods, Failure

Proceedings Papers

Specimen Size Effect on Fatigue Properties of Surface-Micromachined Al-3%Ti Thin Films

Jun-Hyub Park, Man Sik Myung, Yun-Jae Kim

Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 661-665, January 10–13, 2007

Publisher: American Society of Mechanical Engineers

Paper No: MNC2007-21280

https://doi.org/10.1115/MNC2007-21280