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Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 7–9, 2019

Paper No: IPACK2019-6389

DOI: https://doi.org/10.1115/IPACK2019-6389

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Topics: Compression, Contact resistance, Cycles, Fibers, Heat sinks, Microscale devices, Polymers, Pressure, Springs, Surface roughness

Journal Articles

Error Reduction in Infrared Thermography by Multiframe Super-Resolution

Aditya Chandramohan, Sara K. Lyons, Justin A. Weibel, Suresh V. Garimella

J. Electron. Packag. December 2018, 140(4): 041008.

Paper No: EP-18-1028

DOI: https://doi.org/10.1115/1.4041360

Published Online: October 1, 2018

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Topics: Emissivity, Errors, Resolution (Optics), Temperature, Thermography, Uncertainty

Journal Articles

Special Section on IMECE 2016

Justin A. Weibel, S. Ravi Annapragada

J. Electron. Packag. June 2017, 139(2): 020301.

Paper No: EP-17-1032

DOI: https://doi.org/10.1115/1.4036627

Published Online: June 12, 2017

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Topics: Failure analysis, Flexible electronics, Packaging, Reliability, Semiconductor wafers, Solders, Thermal analysis, Electronic packaging

Journal Articles

Transient Analysis of Nonuniform Heat Input Propagation Through a Heat Sink Base

Srivathsan Sudhakar, Justin A. Weibel

J. Electron. Packag. June 2017, 139(2): 020901.

Paper No: EP-17-1004

DOI: https://doi.org/10.1115/1.4036065

Published Online: April 12, 2017

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Topics: Heat, Temperature, Transients (Dynamics), Coolants, Heat sinks

Proceedings Papers

Transient Analysis of Non-Uniform Heat Input Propagation Through a Heat Sink Base

Srivathsan Sudhakar, Justin A. Weibel

Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A055, November 11–17, 2016

Paper No: IMECE2016-67639

DOI: https://doi.org/10.1115/IMECE2016-67639

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Topics: Heat, Heat sinks, Transient analysis, Temperature, Coolants, Transients (Dynamics), Architecture, Boundary-value problems, Flow (Dynamics), Geometry

Journal Articles

Numerical Simulation of Evaporating Two-Phase Flow in a High-Aspect-Ratio Microchannel with Bends

Zhenhai Pan, Justin A. Weibel, Suresh V. Garimella

J. Heat Transfer. February 2017, 139(2): 020901.

Paper No: HT-16-1710

DOI: https://doi.org/10.1115/1.4035571

Published Online: January 6, 2017

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Topics: Computer simulation, Evaporation, Microchannels, Two-phase flow, Flow (Dynamics), Fluids, Lubrication theory, Simulation, Temperature, Vapors

Proceedings Papers

Visualization of Ice Formation Modes and Flow Blockage During Freezing of Water Flowing in a Microchannel

Aakriti Jain, Yonghua Huang, Justin A. Weibel, Suresh V. Garimella

Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T08A015, July 10–14, 2016

Paper No: HT2016-7243

DOI: https://doi.org/10.1115/HT2016-7243

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Topics: Flow (Dynamics), Freezing, Ice, Microchannels, Visualization, Water, Subcooling, Vacuum, Flow control, Glass

Journal Articles

Quantitative Evaluation of the Dependence of Pool Boiling Heat Transfer Enhancement on Sintered Particle Coating Characteristics

Suchismita Sarangi, Justin A. Weibel, Suresh V. Garimella

J. Heat Transfer. February 2017, 139(2): 021502.

Paper No: HT-16-1194

DOI: https://doi.org/10.1115/1.4034901

Published Online: November 8, 2016

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Topics: Boiling, Coating processes, Coatings, Particulate matter, Porosity, Heat transfer, Pool boiling, Copper, Heat transfer coefficients

Journal Articles

A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection

Gaurav Patankar, Simone Mancin, Justin A. Weibel, Suresh V. Garimella, Mark A. MacDonald

J. Electron. Packag. March 2016, 138(1): 010903.

Paper No: EP-15-1083

DOI: https://doi.org/10.1115/1.4032345

Published Online: March 10, 2016

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Topics: Calibration, Condensers (steam plant), Copper, Flat heat pipes, Heat, Heat losses, Natural convection, Temperature, Thermal resistance, Vapors

Proceedings Papers

Effect of Particle Morphology on Pool Boiling From Surfaces Coated With Sintered Particles

Suchismita Sarangi, Justin A. Weibel, Suresh V. Garimella

Proc. ASME. IMECE2015, Volume 8A: Heat Transfer and Thermal Engineering, V08AT10A030, November 13–19, 2015

Paper No: IMECE2015-50238

DOI: https://doi.org/10.1115/IMECE2015-50238

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Topics: Particulate matter, Pool boiling, Coatings, Critical heat flux, Heat transfer coefficients, Boiling, Copper, Heat transfer, Bubbles, Cooling

Proceedings Papers

A Cost-Effective Modeling Approach for Simulating Phase Change and Flow Boiling in Microchannels

Zhenhai Pan, Justin A. Weibel, Suresh V. Garimella

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A023, July 6–9, 2015

Paper No: IPACK2015-48178

DOI: https://doi.org/10.1115/IPACK2015-48178

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Topics: Boiling, Flow (Dynamics), Microchannels, Modeling, Vapors, Bubbles, Simulation, Currents, Errors, Evaporation

Proceedings Papers

Quantitative Visualization of Vapor Bubble Growth in Diabatic Vapor-Liquid Microchannel Slug Flow

Todd A. Kingston, Justin A. Weibel, Suresh V. Garimella

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A014, July 6–9, 2015

Paper No: IPACK2015-48177

DOI: https://doi.org/10.1115/IPACK2015-48177

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Topics: Bubbles, Microchannels, Slug flows, Vapors, Visualization, Flow (Dynamics), Heating, Junctions, Boiling, Borosilicate glasses

Proceedings Papers

A Method for Thermal Performance Characterization of Ultra-Thin Vapor Chambers Cooled by Natural Convection

Gaurav Patankar, Simone Mancin, Justin A. Weibel, Suresh V. Garimella, Mark A. MacDonald

Paper No: IPACK2015-48175

DOI: https://doi.org/10.1115/IPACK2015-48175

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Topics: Natural convection, Performance characterization, Vapors, Heat, Flat heat pipes, Computer simulation, Condensers (steam plant), Energy dissipation, Heat losses, Temperature distribution

Journal Articles

Hierarchical Superhydrophobic Copper for Sustained Dropwise Condensation

Xuemei Chen, Justin A. Weibel

J. Heat Transfer. August 2015, 137(8): 080904.

Paper No: HT-15-1244

DOI: https://doi.org/10.1115/1.4030451

Published Online: August 1, 2015

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Topics: Condensation, Copper, Drops, Heat transfer

Proceedings Papers

Evaporative Particle Deposition on Superhydrophobic Surfaces

Mercy Dicuangco, Susmita Dash, Justin A. Weibel, Suresh V. Garimella

Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A036, November 15–21, 2013

Paper No: IMECE2013-63928

DOI: https://doi.org/10.1115/IMECE2013-63928

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Topics: Particulate matter, Drops, Evaporation, Temperature, Heating, Shapes, Diffusion (Physics), Latex, Manufacturing, Nanowires

Journal citation

NARROW

A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers

Experimental and Modelling Analysis of a Large-Scale Two-Phase Loop Thermosyphon

Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation

The Effect of Uneven Heating on the Flow Distribution Between Parallel Microchannels Undergoing Boiling

Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

Demonstration of a Compliant Micro-Spring Array As a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

Error Reduction in Infrared Thermography by Multiframe Super-Resolution

Special Section on IMECE 2016

Transient Analysis of Nonuniform Heat Input Propagation Through a Heat Sink Base

Transient Analysis of Non-Uniform Heat Input Propagation Through a Heat Sink Base

Numerical Simulation of Evaporating Two-Phase Flow in a High-Aspect-Ratio Microchannel with Bends

Visualization of Ice Formation Modes and Flow Blockage During Freezing of Water Flowing in a Microchannel

Quantitative Evaluation of the Dependence of Pool Boiling Heat Transfer Enhancement on Sintered Particle Coating Characteristics

A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection

Effect of Particle Morphology on Pool Boiling From Surfaces Coated With Sintered Particles

A Cost-Effective Modeling Approach for Simulating Phase Change and Flow Boiling in Microchannels

Quantitative Visualization of Vapor Bubble Growth in Diabatic Vapor-Liquid Microchannel Slug Flow

A Method for Thermal Performance Characterization of Ultra-Thin Vapor Chambers Cooled by Natural Convection

Hierarchical Superhydrophobic Copper for Sustained Dropwise Condensation

Evaporative Particle Deposition on Superhydrophobic Surfaces

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