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Michael Pecht
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Journal Articles
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011014.
Paper No: EP-13-1111
Published Online: February 18, 2014
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A009, July 16–18, 2013
Paper No: IPACK2013-73164
Journal Articles
Proceedings Papers

Proc. ASME. IMECE2010, Volume 11: New Developments in Simulation Methods and Software for Engineering Applications; Safety Engineering, Risk Analysis and Reliability Methods; Transportation Systems, 235-242, November 12–18, 2010
Paper No: IMECE2010-37134
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 201-205, July 6–8, 2011
Paper No: IPACK2011-52111
Proceedings Papers

Proc. ASME. SMASIS2010, ASME 2010 Conference on Smart Materials, Adaptive Structures and Intelligent Systems, Volume 2, 769-773, September 28–October 1, 2010
Paper No: SMASIS2010-3861
Proceedings Papers

Proc. ASME. SMASIS2010, ASME 2010 Conference on Smart Materials, Adaptive Structures and Intelligent Systems, Volume 2, 783-792, September 28–October 1, 2010
Paper No: SMASIS2010-3864
Proceedings Papers

Proc. ASME. IDETC-CIE2009, Volume 2: 29th Computers and Information in Engineering Conference, Parts A and B, 1317-1322, August 30–September 2, 2009
Paper No: DETC2009-87723
Proceedings Papers

Proc. ASME. IDETC-CIE2009, Volume 2: 29th Computers and Information in Engineering Conference, Parts A and B, 1253-1258, August 30–September 2, 2009
Paper No: DETC2009-86280
Proceedings Papers

Proc. ASME. IDETC-CIE2008, Volume 3: 28th Computers and Information in Engineering Conference, Parts A and B, 1383-1389, August 3–6, 2008
Paper No: DETC2008-49907
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 947-953, July 6–11, 2003
Paper No: IPACK2003-35359
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 497-503, July 6–11, 2003
Paper No: IPACK2003-35252
Proceedings Papers

Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 139-146, November 5–11, 2005
Paper No: IMECE2005-82428
Journal Articles