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Journal Articles

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011102.
Paper No: EP-22-1016
DOI: https://doi.org/10.1115/1.4055394
Published Online: September 27, 2022
View Article titled, Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model
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Topics: Anodes, Creep, Current density, Electrodiffusion, Solder joints, Stress, Temperature
Proceedings Papers

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 26–28, 2021
Paper No: IPACK2021-69882
DOI: https://doi.org/10.1115/IPACK2021-69882
View Paper titled, Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model
Open the PDF for Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model in another window
Topics: Electrodiffusion, Intermetallic compounds, Solder joints, Stress
Journal Articles

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical–Thermal-Stress Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021102.
Paper No: EP-21-1053
DOI: https://doi.org/10.1115/1.4052231
Published Online: September 13, 2021
View Article titled, Electromigration Analysis of Solder Joints for Power Modules Using an Electrical–Thermal-Stress Coupled Model
Open the PDF for Electromigration Analysis of Solder Joints for Power Modules Using an Electrical–Thermal-Stress Coupled Model in another window
Topics: Creep, Current density, Electrodiffusion, Solder joints, Temperature, Anodes, Plasticity, Stress
Proceedings Papers

Fatigue Life Law Based on Inelastic Strain Energy Density of Solder Alloys and its Simple Prediction Method

Tomoya Fumikura, Mitsuaki Kato, Takahiro Omori
Proc. ASME. IMECE2020, Volume 12: Mechanics of Solids, Structures, and Fluids, V012T12A015, November 16–19, 2020
Paper No: IMECE2020-23675
DOI: https://doi.org/10.1115/IMECE2020-23675
View Paper titled, Fatigue Life Law Based on Inelastic Strain Energy Density of Solder Alloys and its Simple Prediction Method
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Topics: Alloys, Density, Fatigue life, Solders
Proceedings Papers

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 27–29, 2020
Paper No: IPACK2020-2556
DOI: https://doi.org/10.1115/IPACK2020-2556
View Paper titled, Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model
Open the PDF for Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model in another window
Topics: Electrodiffusion, Intermetallic compounds, Solder joints, Stress
Proceedings Papers

Electromigration Analysis of Power Modules by Electrical-Thermal-Mechanical Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata
Proc. ASME. IMECE2019, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T12A005, November 11–14, 2019
Paper No: IMECE2019-10558
DOI: https://doi.org/10.1115/IMECE2019-10558
View Paper titled, Electromigration Analysis of Power Modules by Electrical-Thermal-Mechanical Coupled Model
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Topics: Bonding, Electrodiffusion, Wire
Proceedings Papers

Evaluation Method for Performance of SiC Power Module by Electro-Thermal-Anisotropic Stress Coupled Analysis

Mitsuaki Kato, Akihiro Goryu, Akira Kano, Kazuto Takao, Kenji Hirohata, Satoshi Izumi
Proc. ASME. IMECE2018, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A001, November 9–15, 2018
Paper No: IMECE2018-86626
DOI: https://doi.org/10.1115/IMECE2018-86626
View Paper titled, Evaluation Method for Performance of SiC Power Module by Electro-Thermal-Anisotropic Stress Coupled Analysis
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Topics: Anisotropy, Evaluation methods, Stress, Circuits, Temperature, Electrical resistance, MOSFET transistors, Simulation, Electrical properties, Energy conversion
Proceedings Papers

Evaluation Method for Mechanical Stress Dependence of the Electrical Characteristics of SiC MOSFET for Electro-Thermal-Structural Coupled Analysis

Akihiro Goryu, Mitsuaki Kato, Akira Kano, Satoshi Izumi, Kenji Hirohata
Proc. ASME. IMECE2017, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A019, November 3–9, 2017
Paper No: IMECE2017-72027
DOI: https://doi.org/10.1115/IMECE2017-72027
View Paper titled, Evaluation Method for Mechanical Stress Dependence of the Electrical Characteristics of SiC MOSFET for Electro-Thermal-Structural Coupled Analysis
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Topics: Evaluation methods, MOSFET transistors, Stress, Circuits, Tension, Compression, Metals, Simulation, Wire, Aluminum
Proceedings Papers

Fast CT-FFR Analysis Method for the Coronary Artery Based on 4D-CT Image Analysis and Structural and Fluid Analysis

Mitsuaki Kato, Kenji Hirohata, Akira Kano, Shinya Higashi, Akihiro Goryu, Takuya Hongo, Shigeo Kaminaga, Yasuko Fujisawa
Proc. ASME. IMECE2015, Volume 3: Biomedical and Biotechnology Engineering, V003T03A023, November 13–19, 2015
Paper No: IMECE2015-51124
DOI: https://doi.org/10.1115/IMECE2015-51124
View Paper titled, Fast CT-FFR Analysis Method for the Coronary Artery Based on 4D-CT Image Analysis and Structural and Fluid Analysis
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Topics: Coronary arteries, Fluids, Vessels, Blood flow, Deformation, Flow (Dynamics), Boundary-value problems, Pressure, Stiffness, Aorta