Search Results | ASME Digital Collection

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, August 29–September 1, 2017

Paper No: IPACK2017-74273

DOI: https://doi.org/10.1115/IPACK2017-74273

View Paper

Topics: Electronic packages, Polymers, Stress, Reliability, Simulation, Weight (Mass), Absorption, Ball-Grid-Array packaging, Corrosion, Cracking (Materials)

Journal Articles

Droplets Jumping from a Hybrid Superhydrophilic and Superhydrophobic Surface

Hai Wang, Quang Nguyen, Jae W. Kwon, Jing Wang, Hongbin Ma

J. Heat Transfer. February 2017, 139(2): 020908.

Paper No: HT-16-1720

DOI: https://doi.org/10.1115/1.4035578

Published Online: January 6, 2017

View Article

Topics: Drops, Condensation, Copper, Film condensation, Nanorods, Sodium, Spin coating, Wetting

Proceedings Papers

Measurement and Simulation of Moisture Induced Die Stresses in Flip Chip on Laminate Assemblies

Quang Nguyen, Jordan C. Roberts, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A040, July 6–9, 2015

Paper No: IPACK2015-48626

DOI: https://doi.org/10.1115/IPACK2015-48626

View Paper

Topics: Flip-chip, Flip-chip devices, Laminates, Simulation, Stress, Flip-chip assemblies, Diffusion (Physics), Storage, Temperature, Absorption

Proceedings Papers

Characterization of Die Stresses in Plastic Packages Subjected to Moisture and Thermal Exposures

Quang Nguyen, M. Kaysar Rahim, Jordan C. Roberts, Jeffrey C. Suhling, Richard C. Jaeger

Paper No: IPACK2015-48627

DOI: https://doi.org/10.1115/IPACK2015-48627

View Paper

Topics: Stress, Shear stress, Molding, Storage, Weight (Mass), Computer simulation, Electronic packages, Engineering simulation, Failure, Finite element analysis

Proceedings Papers

Validation of Material Constants for Low-Cycle Fatigue Modeling

Quang Nguyen, Seungbae Park, Tung Nguyen

Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A055, November 14–20, 2014

Paper No: IMECE2014-39267

DOI: https://doi.org/10.1115/IMECE2014-39267

View Paper

Topics: Low cycle fatigue, Modeling, Computer simulation, Electrical resistance, Failure, Fatigue life, Impact modeling, Lumber, Solder joints, Weibull distribution

Proceedings Papers

Effect of Support Friction in Thermal Stress of VVER-1000 RCS for NOP Condition

Truong Quang Nguyen, Ihn Namgung

Proc. ASME. ICONE22, Volume 1: Plant Operations, Maintenance, Engineering, Modifications, Life Cycle and Balance of Plant; Nuclear Fuel and Materials; Plant Systems, Structures and Components; Codes, Standards, Licensing and Regulatory Issues, V001T03A026, July 7–11, 2014

Paper No: ICONE22-30904

DOI: https://doi.org/10.1115/ICONE22-30904

View Paper

Topics: Friction, Thermal stresses, Boilers, Reactor vessels, Temperature, Stress, Nozzles, Nuclear reactor coolants, Pumps, Yield stress

Proceedings Papers

Characterization of Crack Growth in BGA Under Drop Impact

Quang Nguyen, Seungbae Park, Tung Nguyen

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A002, July 16–18, 2013

Paper No: IPACK2013-73110

DOI: https://doi.org/10.1115/IPACK2013-73110

View Paper

Topics: Ball-Grid-Array packaging, Fracture (Materials), Solder joints, Damage, Imaging, Low cycle fatigue, Microscopes, Polishing, Tin, Vehicles

Journal Articles

Evaluation of Applying Low Calorific Fuel as Reburn Fuel in an Opposed Wall Fired Boiler

Guang Xu, Wei Zhou, Larry W. Swanson, David K. Moyeda, Quang Nguyen

J. Thermal Sci. Eng. Appl. September 2009, 1(3): 031007.

DOI: https://doi.org/10.1115/1.4000985

Published Online: April 6, 2010

View Article

Topics: Boilers, Fuels, Nitrogen oxides, Coal, Furnaces, Heat

Journal citation

NARROW

3D Printed Food Design and Fabrication Approach for Manufacturability, Rheology, and Nutrition Trade-Offs

Condensation and Wetting Behavior on Hybrid Superhydrophobic and Superhydrophilic Copper Surfaces

The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages

Droplets Jumping from a Hybrid Superhydrophilic and Superhydrophobic Surface

Measurement and Simulation of Moisture Induced Die Stresses in Flip Chip on Laminate Assemblies

Characterization of Die Stresses in Plastic Packages Subjected to Moisture and Thermal Exposures

Validation of Material Constants for Low-Cycle Fatigue Modeling

Effect of Support Friction in Thermal Stress of VVER-1000 RCS for NOP Condition

Characterization of Crack Growth in BGA Under Drop Impact

Evaluation of Applying Low Calorific Fuel as Reburn Fuel in an Opposed Wall Fired Boiler

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only