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Ralph L. Webb
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Proceedings Papers

Proc. ASME. IMECE2000, Advances in Enhanced Heat Transfer, 49-57, November 5–10, 2000
Paper No: IMECE2000-1278
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 365-372, July 17–22, 2005
Paper No: IPACK2005-73262
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 699-704, July 6–11, 2003
Paper No: IPACK2003-35354
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 527-535, July 6–11, 2003
Paper No: IPACK2003-35251
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 537-543, July 6–11, 2003
Paper No: IPACK2003-35253
Proceedings Papers

Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 583-591, November 15–21, 2003
Paper No: IMECE2003-42179
Journal Articles
Journal Articles
Journal Articles
Article Type: Technology Review
J. Heat Transfer. December 2004, 126(6): 1051–1059.
Published Online: January 26, 2005
Journal Articles
Journal Articles
Journal Articles
Journal Articles