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Rui Wu
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Journal Articles

Exact Solutions of the Mixed Motion and Path Synthesis Problem for Four-Bar Linkages

Rui Wu, Wenming Yang, Shaoping Bai
Journal: Journal of Mechanisms and Robotics
Publisher: ASME
Article Type: Research Papers
J. Mechanisms Robotics. July 2025, 17(7): 071005.
Paper No: JMR-24-1271
https://doi.org/10.1115/1.4067751
Published Online: February 11, 2025
View Article titled, Exact Solutions of the Mixed Motion and Path Synthesis Problem for Four-Bar Linkages
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Topics: Errors, Linkages, Design
Journal Articles

A Novel Solar Cell Shallow Emitter Formation Process by Ion-Implantation and Dopant Modulation Through Surface Chemical Etching

Wei-Lin Yang, Po-Hung Chen, Kun-Rui Wu, Likarn Wang
Journal: Journal of Solar Energy Engineering
Publisher: ASME
Article Type: Research-Article
J. Sol. Energy Eng. December 2017, 139(6): 061001.
Paper No: SOL-16-1385
https://doi.org/10.1115/1.4037378
Published Online: August 31, 2017
View Article titled, A Novel Solar Cell Shallow Emitter Formation Process by Ion-Implantation and Dopant Modulation Through Surface Chemical Etching
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Topics: Annealing, Chemical etching, Density, Etching, Flow (Dynamics), Ion implantation, Semiconductor wafers, Solar cells, Junctions, Silicon
Proceedings Papers

Influence of Multiaxial Stresses on Creep Properties of Phosphorus Alloyed Oxygen Free Copper

Rui Wu, Lai-Zhe Jin, Rolf Sandstro¨m
Proc. ASME. PVP2009, Volume 6: Materials and Fabrication, Parts A and B, 1525-1532, July 26–30, 2009
Publisher: American Society of Mechanical Engineers
Paper No: PVP2009-77693
https://doi.org/10.1115/PVP2009-77693
View Paper titled, Influence of Multiaxial Stresses on Creep Properties of Phosphorus Alloyed Oxygen Free Copper
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Topics: Copper, Creep, Oxygen, Stress
Proceedings Papers

Reliability of Indium Solder for Cold Temperature Packaging

Rui Wu, F. Patrick McCluskey
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 553-556, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33456
https://doi.org/10.1115/IPACK2007-33456
View Paper titled, Reliability of Indium Solder for Cold Temperature Packaging
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Topics: Packaging, Reliability, Solders, Temperature, Stress, Ceramics, Control systems, Damage, Failure, Fatigue
Journal Articles

Influence of Extra Coarse Grains on the Creep Properties of 9 Percent CrMoV (P91) Steel Weldment

Rui Wu, Rolf Sandstro¨m, Facredin Seitisleam
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. January 2004, 126(1): 87–94.
https://doi.org/10.1115/1.1631025
Published Online: January 22, 2004
View Article titled, Influence of Extra Coarse Grains on the Creep Properties of 9 Percent CrMoV (P91) Steel Weldment
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Topics: Creep, Metals, Rupture, Welding, Steel, Stress, Metallography
Journal Articles

Carbide Coarsening During Creep in 12 Percent CrMoV Steel

Rui Wu, Rolf Sandstro¨m
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. October 1996, 118(4): 485–492.
https://doi.org/10.1115/1.2805946
Published Online: October 1, 1996
View Article titled, Carbide Coarsening During Creep in 12 Percent CrMoV Steel
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Topics: Creep, Steel, Stress, Cavitation, Deformation, Ferrites (Magnetic materials), Gages, Grain boundaries, Rupture, Temperature