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Journal Articles

Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model

Wing K. Yeung, Tung T. Lam
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031011.
Paper No: EP-21-1028
DOI: https://doi.org/10.1115/1.4052948
Published Online: December 27, 2021
View Article titled, Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model
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Topics: Heat flux, Relaxation (Physics), Temperature, Elemental semiconductors, Temperature gradient, Heat
Journal Articles

Thermal Dispersion in Finite Medium Under Periodic Surface Disturbance Using Dual-Phase-Lag Model

Tung T. Lam, Ed Fong
Journal: Journal of Heat Transfer
Article Type: Research-Article
J. Heat Transfer. March 2016, 138(3): 032401.
Paper No: HT-15-1148
DOI: https://doi.org/10.1115/1.4031732
Published Online: November 3, 2015
View Article titled, Thermal Dispersion in Finite Medium Under Periodic Surface Disturbance Using Dual-Phase-Lag Model
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Topics: Heat, Heat conduction, Temperature, Theorems (Mathematics), Diffusion (Physics), Boundary-value problems, Heat flux
Proceedings Papers

Boundary Effect on Temperature Gradients in Microchannels

Patrick S. Cabral, Tung T. Lam
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 401-409, July 6–11, 2003
Paper No: IPACK2003-35190
DOI: https://doi.org/10.1115/IPACK2003-35190
View Paper titled, Boundary Effect on Temperature Gradients in Microchannels
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Topics: Microchannels, Temperature gradient, Boundary-value problems, Heat, Computer cooling, Convection, Cooling, Drag (Fluid dynamics), Electronics, Flow (Dynamics)
Proceedings Papers

Temperature Distribution in Two-Layered Composites

Wing K. Yeung, Tung T. Lam
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 293-302, July 6–11, 2003
Paper No: IPACK2003-35131
DOI: https://doi.org/10.1115/IPACK2003-35131
View Paper titled, Temperature Distribution in Two-Layered Composites
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Topics: Composite materials, Temperature distribution, Anisotropy, Algorithms, Heat, Heat conduction, Reflection, Thermal conductivity, Thermal diffusion, Wave propagation
Proceedings Papers

Heat Transfer in Triangular Microchannels

J. Todd Dickey, Tung T. Lam
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 303-307, July 6–11, 2003
Paper No: IPACK2003-35133
DOI: https://doi.org/10.1115/IPACK2003-35133
View Paper titled, Heat Transfer in Triangular Microchannels
Click here to open pdf in another window PDF for Heat Transfer in Triangular Microchannels
Topics: Heat transfer, Microchannels, Porous materials, Cross section (Physics), Fluid dynamics, Fluids, Microchannel flow