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Proceedings Papers

Effect of Condenser Location and Tubing Length on the Performance of a Compact Two-Phase Thermosyphon

Lang Yuan, Yogendra K. Joshi, Wataru Nakayama

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 291-299, November 11–16, 2001

Paper No: IMECE2001/HTD-24406

DOI: https://doi.org/10.1115/IMECE2001/HTD-24406

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Topics: Condensers (steam plant), Tubing, Thermal resistance, Boiling, Coolants, Cooling, Copper, Degrees of freedom, Design, Dimensions

Proceedings Papers

A Natural Circulation Model of the Closed Loop, Two-Phase Thermosyphon for Electronics Cooling

S. I. Haider, Yogendra K. Joshi, Wataru Nakayama

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 209-218, November 11–16, 2001

Paper No: IMECE2001/HTD-24395

DOI: https://doi.org/10.1115/IMECE2001/HTD-24395

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Topics: Computer cooling, Two-phase flow, Condensers (steam plant), Temperature, Heat transfer coefficients, Condensation, Heat, Heat pipes, Boiling, Fluids

Proceedings Papers

Paradigm Shift in Engineering Design Precipitated by the Advent of Miniaturized Systems

Wataru Nakayama

Proc. ASME. IMECE2000, Successfully Managing the Risk and Development of Your Business and Technology, 11-14, November 5–10, 2000

Paper No: IMECE2000-1170

DOI: https://doi.org/10.1115/IMECE2000-1170

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Topics: Engineering design, Design, Uncertainty, Computer simulation

Journal Articles

Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal Management

Wataru Nakayama

J. Electron. Packag. March 2017, 139(1): 010801.

Paper No: EP-16-1092

DOI: https://doi.org/10.1115/1.4035019

Published Online: November 23, 2016

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Topics: Circuits, Computers, Printed circuit boards, Hardware

Journal Articles

Heat in Computers: Applied Heat Transfer in Information Technology

Wataru Nakayama

J. Heat Transfer. January 2014, 136(1): 013001.

Paper No: HT-13-1378

DOI: https://doi.org/10.1115/1.4025377

Published Online: October 21, 2013

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Topics: Computers, Cooling, Design, Heat, Heat transfer, Temperature, Circuits, Hardware, Computational fluid dynamics, Flow (Dynamics)

Journal Articles

Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model

Wataru Nakayama

J. Electron. Packag. September 2013, 135(3): 034501.

Paper No: EP-11-1100

DOI: https://doi.org/10.1115/1.4024367

Published Online: June 4, 2013

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Topics: Heat, Heat conduction, Temperature, Thermal conductivity, Electronic equipment

Journal Articles

Study on Heat Conduction in a Simulated Multicore Processor Chip—Part II: Case Studies

Wataru Nakayama

J. Electron. Packag. June 2013, 135(2): 021003.

Paper No: EP-12-1032

DOI: https://doi.org/10.1115/1.4023292

Published Online: March 28, 2013

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Topics: Cooling, Heat, Heat transfer coefficients, Temperature, Heat conduction, Heat sinks, Dimensions

Journal Articles

Study on Heat Conduction in a Simulated Multicore Processor Chip—Part I: Analytical Modeling

Wataru Nakayama

J. Electron. Packag. June 2013, 135(2): 021002.

Paper No: EP-12-1031

DOI: https://doi.org/10.1115/1.4023291

Published Online: March 28, 2013

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Topics: Heat, Temperature, Heat conduction

Proceedings Papers

The Liquid Bridge Heat Switch Design With Considering the Pressure Behavior to Regulate the Thermal Resistance for the Temperature Control

Su-Heon Jeong, Wataru Nakayama, Sun-Kyu Lee

Proc. ASME. IMECE2010, Volume 7: Fluid Flow, Heat Transfer and Thermal Systems, Parts A and B, 1345-1348, November 12–18, 2010

Paper No: IMECE2010-40336

DOI: https://doi.org/10.1115/IMECE2010-40336

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Topics: Bridges (Structures), Design, Heat, Pressure, Switches, Temperature control, Thermal resistance, Plates (structures), Temperature, Flow (Dynamics)

Proceedings Papers

Resistance Network Analysis of Airflow and Heat Transfer in a Thin Electronic Equipment Enclosure With a Localized Finned Heat Sink

Takashi Fukue, Masaru Ishizuka, Shinji Nakagawa, Tomoyuki Hatakeyama, Wataru Nakayama

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 657-664, August 8–13, 2010

Paper No: IHTC14-22979

DOI: https://doi.org/10.1115/IHTC14-22979

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Topics: Air flow, Electronic equipment, Heat sinks, Heat transfer, Network analysis, Electrical components, Design, Computational fluid dynamics, Design methodology, Flow (Dynamics)

Proceedings Papers

Thermal Characterization of High-Density Interconnects in the Form of Equivalent Thermal Conductivity

Wataru Nakayama, Katsuhiro Koizumi, Takashi Fukue, Masaru Ishizuka, Tatsuya Nakajima, Hiroko Koike, Ryuichi Matsuki

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 297-310, July 19–23, 2009

Paper No: InterPACK2009-89086

DOI: https://doi.org/10.1115/InterPACK2009-89086

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Topics: Density, Thermal characterization, Thermal conductivity, Metals, Flow (Dynamics), Heat, Heat conduction, Copper, Electrical wires, Japan Society of Mechanical Engineers

Proceedings Papers

Heat Switch to Control the Local Thermal Resistance Using Liquid Pillar Control

Su-Heon Jeong, Wataru Nakayama, Sun-Kyu Lee

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1021-1024, July 19–23, 2009

Paper No: InterPACK2009-89368

DOI: https://doi.org/10.1115/InterPACK2009-89368

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Topics: Columns (Structural), Heat, Switches, Thermal resistance, Electronic packages, Temperature, Flow (Dynamics), Geometry, Plates (structures), Reservoirs

Proceedings Papers

Estimation of Thermal Parameters of the Compact Electronic Enclosure Using Dynamic Thermal Response

Jung-Kyun Kim, Wataru Nakayama, Sun-Kyu Lee

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 103-111, July 19–23, 2009

Paper No: InterPACK2009-89033

DOI: https://doi.org/10.1115/InterPACK2009-89033

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Topics: Contact resistance, Electronic packages, Heat, Modeling, System dynamics, Temperature, Transients (Dynamics)

Proceedings Papers

Heat Conduction in Printed Circuit Boards: Part I — Overview and the Case of a JEDEC Test Board

Wataru Nakayama, Tatsuya Nakajima, Hiroko Koike, Ryuichi Matsuki

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 645-652, July 8–12, 2007

Paper No: IPACK2007-33605

DOI: https://doi.org/10.1115/IPACK2007-33605

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Topics: Heat conduction, Printed circuit boards, Modeling, Temperature, Ball-Grid-Array packages, Composite materials, Computation, Convection, Electronic equipment, Heat transfer

Proceedings Papers

Heat Conduction in Printed Circuit Boards: Part II — Small PCBs Connected to Large Thermal Mass at Their Edge

Wataru Nakayama, Tatsuya Nakajima, Hiroko Koike, Ryuichi Matsuki

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 653-661, July 8–12, 2007

Paper No: IPACK2007-33606

DOI: https://doi.org/10.1115/IPACK2007-33606

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Topics: Heat conduction, Printed circuit boards, Heat sinks, Convection, Copper, Density, Flow (Dynamics), Heat, Modeling, Numerical analysis

Proceedings Papers

Synthesis of CFD Analyses and Experiments in Developing a Thermal Network Model of a Simulated Heat Spreader Panel

Masaru Ishizuka, Shinji Nakagawa, Tatsuro Yoshida, Wataru Nakayama

Proc. ASME. IMECE2008, Volume 10: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B, and C, 1471-1478, October 31–November 6, 2008

Paper No: IMECE2008-66091

DOI: https://doi.org/10.1115/IMECE2008-66091

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Topics: Computational fluid dynamics, Flat heat pipes, Network models, Heat, Temperature, Uncertainty, Computation, Corners (Structural elements), Design, Electronic products

Proceedings Papers

Educational Effects of Industry-Academia Joint Projects on the Development of Microelectronic Packaging Technologies: Recent Experiences in Japan

Wataru Nakayama, Masaki Shiratori, Noriyuki Miyazaki

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 1-6, July 6–11, 2003

Paper No: IPACK2003-35122

DOI: https://doi.org/10.1115/IPACK2003-35122

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Topics: Microelectronic packaging, Education, Engineers, Arches, Engineering teachers, Governments, Japan Society of Mechanical Engineers

Proceedings Papers

Electronic Packaging Education Through Internet: A Plan at Tohoku University and Some Challenges in Sight

Ryuzo Watanabe, Wataru Nakayama, Masaru Ishizuka, Shigenao Maruyama, Masud Behnia

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 7-10, July 6–11, 2003

Paper No: IPACK2003-35333

DOI: https://doi.org/10.1115/IPACK2003-35333

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Topics: Education, Electronic packaging, Internet, Columns (Structural), Electronic equipment, Thermal management

Journal Articles

Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach

Wataru Nakayama

J. Electron. Packag. December 2008, 130(4): 041106.

DOI: https://doi.org/10.1115/1.2993126

Published Online: November 14, 2008

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Topics: Copper, Flow (Dynamics), Heat, Heat conduction, Insulation, Laminates, Modeling, Printed circuit boards, Resins, Temperature

Journal Articles

Design of Heat Conduction Panel: The Case of Multiple Heating Elements Cooled by a Displaced Heat Sink

Wataru Nakayama

J. Electron. Packag. December 2008, 130(4): 041108.

DOI: https://doi.org/10.1115/1.2993137

Published Online: November 14, 2008

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Topics: Design, Heat, Heat conduction, Heat sinks, Temperature, Tiles, Genetic algorithms

Journal citation

NARROW

Effect of Condenser Location and Tubing Length on the Performance of a Compact Two-Phase Thermosyphon

A Natural Circulation Model of the Closed Loop, Two-Phase Thermosyphon for Electronics Cooling

Paradigm Shift in Engineering Design Precipitated by the Advent of Miniaturized Systems

Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal Management

Heat in Computers: Applied Heat Transfer in Information Technology

Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model

Study on Heat Conduction in a Simulated Multicore Processor Chip—Part II: Case Studies

Study on Heat Conduction in a Simulated Multicore Processor Chip—Part I: Analytical Modeling

The Liquid Bridge Heat Switch Design With Considering the Pressure Behavior to Regulate the Thermal Resistance for the Temperature Control

Resistance Network Analysis of Airflow and Heat Transfer in a Thin Electronic Equipment Enclosure With a Localized Finned Heat Sink

Thermal Characterization of High-Density Interconnects in the Form of Equivalent Thermal Conductivity

Heat Switch to Control the Local Thermal Resistance Using Liquid Pillar Control

Estimation of Thermal Parameters of the Compact Electronic Enclosure Using Dynamic Thermal Response

Heat Conduction in Printed Circuit Boards: Part I — Overview and the Case of a JEDEC Test Board

Heat Conduction in Printed Circuit Boards: Part II — Small PCBs Connected to Large Thermal Mass at Their Edge

Synthesis of CFD Analyses and Experiments in Developing a Thermal Network Model of a Simulated Heat Spreader Panel

Educational Effects of Industry-Academia Joint Projects on the Development of Microelectronic Packaging Technologies: Recent Experiences in Japan

Electronic Packaging Education Through Internet: A Plan at Tohoku University and Some Challenges in Sight

Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach

Design of Heat Conduction Panel: The Case of Multiple Heating Elements Cooled by a Displaced Heat Sink

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