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Weijie Jiang
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Journal Articles

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

Xingjun Yao, Weijie Jiang, Jiahui Yang, Junjie Fang, Wenjun Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041003.
Paper No: EP-20-1094
https://doi.org/10.1115/1.4052275
Published Online: November 22, 2021
View Article titled, A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging
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Topics: Computational fluid dynamics, Flip-chip, Flip-chip packages, Flow (Dynamics), Simulation, Solders, Surface energy, Uncertainty, Shapes, Packaging
Journal Articles

Capacity Analysis and Safety Assessment of Polyethylene Pipeline With Local Wall-Thinning Defect

Weijie Jiang, Jianping Zhao
Journal: Journal of Pressure Vessel Technology
Publisher: ASME
Article Type: Research-Article
J. Pressure Vessel Technol. December 2015, 137(6): 061203.
Paper No: PVT-13-1181
https://doi.org/10.1115/1.4030427
Published Online: December 1, 2015
View Article titled, Capacity Analysis and Safety Assessment of Polyethylene Pipeline With Local Wall-Thinning Defect
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Topics: Finite element analysis, Polyethylene pipes, Safety, Stress, Pipes, Pressure, Constitutive equations, Metals
Proceedings Papers

Capacity Analysis of PE Pipeline With Non-Planar Defect

Weijie Jiang, Jianping Zhao, Dingyue Chen
Proc. ASME. PVP2013, Volume 6B: Materials and Fabrication, V06BT06A036, July 14–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: PVP2013-97616
https://doi.org/10.1115/PVP2013-97616
View Paper titled, Capacity Analysis of PE Pipeline With Non-Planar Defect
Open the PDF for Capacity Analysis of PE Pipeline With Non-Planar Defect in another window
Topics: Constitutive equations, Design, Equipment performance, Finite element analysis, Pipelines, Pipes, Polyethylene pipes, Pressure, Safety, Stress