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Wing K. Yeung
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Journal Articles

Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model

Wing K. Yeung, Tung T. Lam
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031011.
Paper No: EP-21-1028
DOI: https://doi.org/10.1115/1.4052948
Published Online: December 27, 2021
View Article titled, Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model
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Topics: Heat flux, Relaxation (Physics), Temperature, Elemental semiconductors, Temperature gradient, Heat
Proceedings Papers

Temperature Distribution in Two-Layered Composites

Wing K. Yeung, Tung T. Lam
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 293-302, July 6–11, 2003
Paper No: IPACK2003-35131
DOI: https://doi.org/10.1115/IPACK2003-35131
View Paper titled, Temperature Distribution in Two-Layered Composites
Click here to open pdf in another window PDF for Temperature Distribution in Two-Layered Composites
Topics: Composite materials, Temperature distribution, Anisotropy, Algorithms, Heat, Heat conduction, Reflection, Thermal conductivity, Thermal diffusion, Wave propagation