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Proceedings Papers

Rapid and Versatile Micromold Fabrication Using Micromilling and Nanopolishing for Microfluidic Devices

Thanh-Qua Nguyen, Jeongmin Mah, Woo-Tae Park, Sangyoup Lee
Proc. ASME. AJKFluids2019, Volume 4: Fluid Measurement and Instrumentation; Micro and Nano Fluid Dynamics, V004T06A011, July 28–August 1, 2019
Paper No: AJKFluids2019-5398
DOI: https://doi.org/10.1115/AJKFluids2019-5398
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Topics: Manufacturing, Microfluidics, Micromilling, Surface roughness, Machining, Computer numerical control machine tools, Polishing, Bonding, Computers, Design
Proceedings Papers

Immobilization of Magnetic Beads for Microfluidic Immunoassays

Thanh-Qua Nguyen, Jeongyun Kim, Daewoong Lee, Ji-Seob Choi, Jaeho Park, Hojeong Jeon, Woo-Tae Park, Sangyoup Lee
Proc. ASME. AJKFluids2019, Volume 4: Fluid Measurement and Instrumentation; Micro and Nano Fluid Dynamics, V004T06A017, July 28–August 1, 2019
Paper No: AJKFluids2019-5401
DOI: https://doi.org/10.1115/AJKFluids2019-5401
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Topics: Microfluidics, Biomedicine, Flow (Dynamics), Microscale devices, Separation (Technology), Signals, Valves
Proceedings Papers

Wafer Scale Encapsulation of MEMS Devices

Woo-Tae Park, Rob N. Candler, Huimou J. Li, Junghwa Cho, Holden Li, Thomas W. Kenny, Aaron Partridge, Gary Yama, Markus Lutz
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 209-212, July 6–11, 2003
Paper No: IPACK2003-35032
DOI: https://doi.org/10.1115/IPACK2003-35032
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Topics: Microelectromechanical systems, Semiconductor wafers, Packaging, Silicon, Electronics, MEMS packaging, Sealing (Process), Wire bonding
Proceedings Papers

An Integrated Wafer-Scale Packaging Process for MEMS

Thomas W. Kenny, Rob N. Candler, Huimou J. Li, Woo-Tae Park, Junghwa Cho, Holden Li, Aaron Partridge, Gary Yama, Marcus Lutz
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 51-54, November 17–22, 2002
Paper No: IMECE2002-39270
DOI: https://doi.org/10.1115/IMECE2002-39270
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Topics: Microelectromechanical systems, Packaging, Semiconductor wafers, Electronics, High pressure (Physics), Injection molding, Manufacturing, Polysilicon
Proceedings Papers

Investigation of MEMS Resonator Characteristics for Long-Term and Wide Temperature Variation Operation

Bongsang Kim, Rob N. Candler, Matthew Hopcroft, Manu Agarwal, Woo-Tae Park, Jeffrey T. Li, Thomas Kenny
Proc. ASME. IMECE2004, Microelectromechanical Systems, 413-416, November 13–19, 2004
Paper No: IMECE2004-61727
DOI: https://doi.org/10.1115/IMECE2004-61727
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Topics: Microelectromechanical systems, Temperature, Stability, Resonance, Micromechanical resonators, Q-factor, Crystals, Silicon