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Proceedings Papers

Visualization of Two-Phase Flow in 3D Printed Polycarbonate Pulsating Heat Pipe With Aluminum Substrate

Takahiro Arai, Masahiro Kawaji, Yasushi Koito

Proc. ASME. ICNMM2018, ASME 2018 16th International Conference on Nanochannels, Microchannels, and Minichannels, V001T02A010, June 10–13, 2018

Paper No: ICNMM2018-7677

DOI: https://doi.org/10.1115/ICNMM2018-7677

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Topics: Additive manufacturing, Aluminum, Heat pipes, Two-phase flow, Visualization, Flow (Dynamics), Heat, Aluminum plate, Condensers (steam plant), Flow visualization

Proceedings Papers

Heat Transfer Characteristics of a 3-D Printed Pulsating Heat Pipe: Fundamental Experiments Using Water As a Working Fluid

Yasushi Koito, Masahiro Kawaji

Proc. ASME. ICNMM2017, ASME 2017 15th International Conference on Nanochannels, Microchannels, and Minichannels, V001T05A003, August 27–30, 2017

Paper No: ICNMM2017-5550

DOI: https://doi.org/10.1115/ICNMM2017-5550

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Topics: Fluids, Heat pipes, Heat transfer, Water, Cooling, Ethanol, Graphene, Condensers (steam plant), Copper, Electric current

Proceedings Papers

Performance of a Pulsating Heat Pipe Fabricated With a 3-D Printer

Yasushi Koito, Masahiro Kawaji

Proc. ASME. HT2017, Volume 2: Heat Transfer Equipment; Heat Transfer in Multiphase Systems; Heat Transfer Under Extreme Conditions; Nanoscale Transport Phenomena; Theory and Fundamental Research in Heat Transfer; Thermophysical Properties; Transport Phenomena in Materials Processing and Manufacturing, V002T11A010, July 9–12, 2017

Paper No: HT2017-4816

DOI: https://doi.org/10.1115/HT2017-4816

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Topics: Heat pipes, Graphene, Condensers (steam plant), Cooling, Fluids, Two-phase flow, Additive manufacturing, Copper, Electric current, Ethanol

Proceedings Papers

A Capillary-Wick Heat Pipe Fabricated on a Plastic Board (Fundamental Experiments on Heat Transport Characteristics)

Yasushi Koito, Hiroyuki Maehara, Daisuke Shimada, Toshio Tomimura

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A028, July 6–9, 2015

Paper No: IPACK2015-48308

DOI: https://doi.org/10.1115/IPACK2015-48308

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Topics: Heat, Heat pipes, Heat transfer, Thermal conductivity, Water, Circuits, Condensers (steam plant), Copper powders, Dimensions, Fluids

Proceedings Papers

Fabrication of a Vapor Chamber on a Plastic Board

Fumihiko Hideyama, Shuto Nonoshita, Yasushi Koito, Toshio Tomimura

Paper No: IPACK2015-48554

DOI: https://doi.org/10.1115/IPACK2015-48554

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Topics: Manufacturing, Vapors, Heat transfer, Cooling, Heat, Fluids, Water, Condensers (steam plant), Copper powders, Flat heat pipes

Proceedings Papers

On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model)

Toshio Tomimura, Yasushi Koito, Taewan Do, Masaru Ishizuka, Tomoyuki Hatakeyama

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A073, July 6–9, 2015

Paper No: IPACK2015-48302

DOI: https://doi.org/10.1115/IPACK2015-48302

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Topics: Contact resistance, Pressure, Heat, Surface roughness, Temperature, Bearings, Control systems, Electronic equipment, Errors, Satellites

Proceedings Papers

Fabrication of Heat Pipes on an Acrylic Resin Board

Yasushi Koito, Hiroyuki Maehara, Toshio Tomimura

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A050, July 16–18, 2013

Paper No: IPACK2013-73277

DOI: https://doi.org/10.1115/IPACK2013-73277

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Topics: Heat pipes, Manufacturing, Resins, Heat transfer, Electrical wires, Fluids, Thermal conductivity, Water, Condensers (steam plant), Gravity (Force)

Proceedings Papers

Fundamental Study on Thermal Characteristics of Heat Spreaders

Yasushi Koito, Yusaku Nonaka, Toshio Tomimura

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 179-184, July 6–8, 2011

Paper No: IPACK2011-52099

DOI: https://doi.org/10.1115/IPACK2011-52099

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Topics: Flat heat pipes, Design, Heat, Disks, Flow (Dynamics), Heat flux, Heat sinks, Heat transfer, Numerical analysis, Photonic systems

Proceedings Papers

Evaluation of Effective Thermal Conductivity of Multilayer Printed Circuit Board

Toshio Tomimura, Yoshihiro Shiotsu, Yasushi Koito, Masaru Ishizuka, Tomoyuki Hatakeyama

Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T10157, March 13–17, 2011

Paper No: AJTEC2011-44232

DOI: https://doi.org/10.1115/AJTEC2011-44232

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Topics: Anisotropy, Design, Printed circuit boards, Thermal conductivity

Proceedings Papers

Theoretical Investigation on Effective Thermal Conductivity of a Disk-Shaped Composite System

Yasushi Koito, Toshio Tomimura, Shuichi Torii

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 585-592, August 8–13, 2010

Paper No: IHTC14-22870

DOI: https://doi.org/10.1115/IHTC14-22870

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Topics: Composite materials, Disks, Thermal conductivity, Electrical wires, Metals, Thermal resistance, Computer simulation, Heat transfer

Proceedings Papers

Application of Excel to Thermal Analysis of Electronic Equipment: Program-Less Analysis and Visualization of Its Process by Using Spreadsheet of Excel

Toshio Tomimura, Yasushi Koito, Shuichi Torii, Masaru Ishizuka

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 527-533, July 19–23, 2009

Paper No: InterPACK2009-89277

DOI: https://doi.org/10.1115/InterPACK2009-89277

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Topics: Electronic equipment, Thermal analysis, Visualization, Computer software, Finite difference methods, Numerical analysis, Printed circuit boards

Proceedings Papers

Mathematical Approaches for Thermal Design of a Vapor Chamber

Yasushi Koito, Yuta Shiki, Masataka Mochizuki, Shuichi Torii, Toshio Tomimura

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 535-544, July 19–23, 2009

Paper No: InterPACK2009-89279

DOI: https://doi.org/10.1115/InterPACK2009-89279

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Topics: Design, Vapors, Temperature distribution, Disks, Heat conduction, Momentum, Pressure, Simulation

Journal citation

NARROW

Visualization of Two-Phase Flow in 3D Printed Polycarbonate Pulsating Heat Pipe With Aluminum Substrate

Heat Transfer Characteristics of a 3-D Printed Pulsating Heat Pipe: Fundamental Experiments Using Water As a Working Fluid

Performance of a Pulsating Heat Pipe Fabricated With a 3-D Printer

A Capillary-Wick Heat Pipe Fabricated on a Plastic Board (Fundamental Experiments on Heat Transport Characteristics)

Fabrication of a Vapor Chamber on a Plastic Board

On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model)

Fabrication of Heat Pipes on an Acrylic Resin Board

Fundamental Study on Thermal Characteristics of Heat Spreaders

Evaluation of Effective Thermal Conductivity of Multilayer Printed Circuit Board

Theoretical Investigation on Effective Thermal Conductivity of a Disk-Shaped Composite System

Application of Excel to Thermal Analysis of Electronic Equipment: Program-Less Analysis and Visualization of Its Process by Using Spreadsheet of Excel

Mathematical Approaches for Thermal Design of a Vapor Chamber

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