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Proceedings Papers

Application of Block-Implicit Multigrid Approach to Heat Transfer Problems Involving Discrete Heating

Proc. ASME. IMECE98, Heat Transfer: Volume 5 — Numerical and Experimental Methods in Heat Transfer, 23-32, November 15–20, 1998

Paper No: IMECE1998-0719

DOI: https://doi.org/10.1115/IMECE1998-0719

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Topics: Heat transfer, Heating, Heat, Forced convection, Boundary-value problems, Natural convection, Pressure, Rayleigh number, Reynolds number

Proceedings Papers

Effect of Condenser Location and Tubing Length on the Performance of a Compact Two-Phase Thermosyphon

Lang Yuan, Yogendra K. Joshi, Wataru Nakayama

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 291-299, November 11–16, 2001

Paper No: IMECE2001/HTD-24406

DOI: https://doi.org/10.1115/IMECE2001/HTD-24406

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Topics: Condensers (steam plant), Tubing, Thermal resistance, Boiling, Coolants, Cooling, Copper, Degrees of freedom, Design, Dimensions

Proceedings Papers

A Natural Circulation Model of the Closed Loop, Two-Phase Thermosyphon for Electronics Cooling

S. I. Haider, Yogendra K. Joshi, Wataru Nakayama

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 209-218, November 11–16, 2001

Paper No: IMECE2001/HTD-24395

DOI: https://doi.org/10.1115/IMECE2001/HTD-24395

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Topics: Computer cooling, Two-phase flow, Condensers (steam plant), Temperature, Heat transfer coefficients, Condensation, Heat, Heat pipes, Boiling, Fluids

Journal Articles

Two-Phase Heat Transfer and Flow Regimes in Pin Fin-Enhanced Microgaps—Effect of Pin Spacing

Pouya Asrar, S. Mostafa Ghiaasiaan, Yogendra K. Joshi

J. Heat Transfer. February 2021, 143(2): 023001.

Paper No: HT-19-1429

DOI: https://doi.org/10.1115/1.4048919

Published Online: November 16, 2020

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Topics: Boiling, Flow (Dynamics), Heat flux, Fins, Heat transfer coefficients, Vapors, Heat transfer, Two-phase flow

Journal Articles

Comparison of Single-Phase Convection in Additive Manufactured Versus Traditional Metal Foams

Justin Broughton, Yogendra K. Joshi

J. Heat Mass Transfer. August 2020, 142(8): 082201.

Paper No: HT-19-1558

DOI: https://doi.org/10.1115/1.4046972

Published Online: June 8, 2020

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Topics: Additive manufacturing, Flow (Dynamics), Fluids, Foams (Chemistry), Heat transfer, Metal foams, Porosity, Thermal conductivity, Pressure drop, Heat transfer coefficients

Journal Articles

Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes

Justin Broughton, Vanessa Smet, Rao R. Tummala, Yogendra K. Joshi

J. Electron. Packag. December 2018, 140(4): 040801.

Paper No: EP-17-1128

DOI: https://doi.org/10.1115/1.4040828

Published Online: August 20, 2018

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Topics: Cooling, Electronics, Packaging, Temperature, Silicon, High temperature, Heat

Journal Articles

Computational Fluid Dynamics Modeling of Flow Boiling in Microchannels With Nonuniform Heat Flux

Daniel Lorenzini, Yogendra K. Joshi

J. Heat Transfer. January 2018, 140(1): 011501.

Paper No: HT-16-1351

DOI: https://doi.org/10.1115/1.4037343

Published Online: August 23, 2017

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Topics: Boiling, Computational fluid dynamics, Flow (Dynamics), Heat flux, Microchannels, Pressure drop, Temperature, Two-phase flow, Vapors, Silicon

Journal Articles

Transient Heat Conduction in On-Chip Interconnects Using Proper Orthogonal Decomposition Method

Banafsheh Barabadi, Satish Kumar, Yogendra K. Joshi

J. Heat Transfer. July 2017, 139(7): 072101.

Paper No: HT-13-1223

DOI: https://doi.org/10.1115/1.4035889

Published Online: March 21, 2017

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Topics: Heat, Heating, Joules, Principal component analysis, Temperature, Transient heat transfer, Transients (Dynamics), Simulation, Microelectronic devices

Proceedings Papers

Energy Simulations of Data Centers With Hybrid Liquid/Air Cooling and Waste Heat Re-Use

Seungho Mok, Yogendra K. Joshi, Satish Kumar, Ronald R. Hutchins

Proc. ASME. IMECE2016, Volume 8: Heat Transfer and Thermal Engineering, V008T10A008, November 11–17, 2016

Paper No: IMECE2016-67625

DOI: https://doi.org/10.1115/IMECE2016-67625

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Topics: Cooling, Data centers, Engineering simulation, Simulation, Waste heat, Cooling systems, Water, Blades, Energy consumption, Groundwater

Journal Articles

Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps

Mohamed H. Nasr, Craig E. Green, Peter A. Kottke, Xuchen Zhang, Thomas E. Sarvey, Yogendra K. Joshi, Muhannad S. Bakir, Andrei G. Fedorov

J. Electron. Packag. March 2017, 139(1): 011006.

Paper No: EP-16-1097

DOI: https://doi.org/10.1115/1.4035387

Published Online: January 5, 2017

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Topics: Boiling, Flow (Dynamics), Flux (Metallurgy), Heat, Thermal resistance, Heat flux, Wall temperature, Coolants, Pressure drop, Thermal management

Proceedings Papers

Thermal Performance Enhancement of Glass Interposer

Sangbeom Cho, Yogendra K. Joshi

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A021, July 6–9, 2015

Paper No: IPACK2015-48563

DOI: https://doi.org/10.1115/IPACK2015-48563

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Topics: Glass, Electronics, Packaging, Brittleness, Computer simulation, Cooling, Copper, Design, Electrical resistivity, Modeling

Proceedings Papers

CFD Analysis of Flow Boiling in a Silicon Microchannel With Non-Uniform Heat Flux

Daniel Lorenzini, Yogendra K. Joshi

Proc. ASME. ICNMM2015, ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, V001T07A014, July 6–9, 2015

Paper No: ICNMM2015-48098

DOI: https://doi.org/10.1115/ICNMM2015-48098

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Topics: Boiling, Computational fluid dynamics, Flow (Dynamics), Heat flux, Microchannels, Silicon, Heat, Flux (Metallurgy), Microelectronic devices, Cooling

Journal Articles

Multiscale Transient Thermal Analysis of Microelectronics

Banafsheh Barabadi, Satish Kumar, Valeriy Sukharev, Yogendra K. Joshi

J. Electron. Packag. September 2015, 137(3): 031002.

Paper No: EP-13-1037

DOI: https://doi.org/10.1115/1.4029835

Published Online: September 1, 2015

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Topics: Microelectronic devices, Modeling, Simulation, Temperature, Thermal analysis, Transients (Dynamics), Temperature distribution

Journal Articles

Two-Phase Convective Cooling for Ultrahigh Power Dissipation in Microprocessors

Peter A. Kottke, Thomas M. Yun, Craig E. Green, Yogendra K. Joshi, Andrei G. Fedorov

J. Heat Transfer. January 2016, 138(1): 011501.

Paper No: HT-15-1103

DOI: https://doi.org/10.1115/1.4031111

Published Online: August 11, 2015

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Topics: Coolants, Cooling, Energy dissipation, Friction, Heat, Heat transfer, Pressure, Pressure drop, Temperature, Vapors

Journal Articles

Compact Model-Based Microfluidic Controller for Energy Efficient Thermal Management Using Single Tier and Three-Dimensional Stacked Pin-Fin Enhanced Microgap

Xuefei Han, Yogendra K. Joshi

J. Electron. Packag. March 2015, 137(1): 011008.

Paper No: EP-13-1083

DOI: https://doi.org/10.1115/1.4028574

Published Online: October 15, 2014

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Topics: Computational fluid dynamics, Control equipment, Flow (Dynamics), Fluids, Heat, Modeling, Temperature, Thermal management, Microfluidics

Journal Articles

Transient Characterization of Hybrid Microfluidic-Thermoelectric Cooling Scheme for Dynamic Thermal Management of Microprocessor

Vivek Sahu, Andrei G. Fedorov, Yogendra K. Joshi

J. Electron. Packag. September 2014, 136(3): 031014.

Paper No: EP-13-1105

DOI: https://doi.org/10.1115/1.4027901

Published Online: July 15, 2014

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Topics: Cooling, Superlattices, Temperature, Transients (Dynamics), Microchannels

Proceedings Papers

Pressure Drop and Heat Transfer Characteristics of Pin Fin Enhanced Microgaps in Single Phase Microfluidic Cooling

Zhimin Wan, Yogendra K. Joshi

Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A086, November 15–21, 2013

Paper No: IMECE2013-65618

DOI: https://doi.org/10.1115/IMECE2013-65618

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Topics: Cooling, Heat transfer, Microfluidics, Pressure drop, Dimensions, Fins, Computer simulation, Delays, Errors, Friction

Proceedings Papers

Compact Modeling of 3D Stacked Die Inter-Tier Microfluidic Cooling Under Non-Uniform Heat Flux

Zhimin Wan, Yoon Jo Kim, Yogendra K. Joshi

Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 911-917, November 9–15, 2012

Paper No: IMECE2012-88890

DOI: https://doi.org/10.1115/IMECE2012-88890

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Topics: Cooling, Heat flux, Microfluidics, Modeling, Temperature, Computational fluid dynamics, Heat, Thermal management, Coolants, Errors

Proceedings Papers

Multi-Scale Transient Thermal Analysis of Microelectronics

Banafsheh Barabadi, Satish Kumar, Valeriy Sukharev, Yogendra K. Joshi

Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 767-774, November 9–15, 2012

Paper No: IMECE2012-89864

DOI: https://doi.org/10.1115/IMECE2012-89864

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Topics: Microelectronic devices, Thermal analysis, Transients (Dynamics), Arches, Ball-Grid-Array packaging, Energy efficiency, Finite element analysis, Finite element model, Flip-chip, Flip-chip devices

Proceedings Papers

Compact Model Based Microfluidic Controller for Energy Efficient Thermal Management of Single Tier and 3D Chips

Xuefei Han, Yogendra K. Joshi

Proc. ASME. ICNMM2012, ASME 2012 10th International Conference on Nanochannels, Microchannels, and Minichannels, 845-852, July 8–12, 2012

Paper No: ICNMM2012-73267

DOI: https://doi.org/10.1115/ICNMM2012-73267

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Topics: Control equipment, Microfluidics, Thermal management, Cooling, Flow (Dynamics), Microchannels, Computational fluid dynamics, Energy consumption, Energy dissipation, Heat

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Journal citation

NARROW

Application of Block-Implicit Multigrid Approach to Heat Transfer Problems Involving Discrete Heating

Effect of Condenser Location and Tubing Length on the Performance of a Compact Two-Phase Thermosyphon

A Natural Circulation Model of the Closed Loop, Two-Phase Thermosyphon for Electronics Cooling

Two-Phase Heat Transfer and Flow Regimes in Pin Fin-Enhanced Microgaps—Effect of Pin Spacing

Comparison of Single-Phase Convection in Additive Manufactured Versus Traditional Metal Foams

Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes

Computational Fluid Dynamics Modeling of Flow Boiling in Microchannels With Nonuniform Heat Flux

Transient Heat Conduction in On-Chip Interconnects Using Proper Orthogonal Decomposition Method

Energy Simulations of Data Centers With Hybrid Liquid/Air Cooling and Waste Heat Re-Use

Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps

Thermal Performance Enhancement of Glass Interposer

CFD Analysis of Flow Boiling in a Silicon Microchannel With Non-Uniform Heat Flux

Multiscale Transient Thermal Analysis of Microelectronics

Two-Phase Convective Cooling for Ultrahigh Power Dissipation in Microprocessors

Compact Model-Based Microfluidic Controller for Energy Efficient Thermal Management Using Single Tier and Three-Dimensional Stacked Pin-Fin Enhanced Microgap

Transient Characterization of Hybrid Microfluidic-Thermoelectric Cooling Scheme for Dynamic Thermal Management of Microprocessor

Pressure Drop and Heat Transfer Characteristics of Pin Fin Enhanced Microgaps in Single Phase Microfluidic Cooling

Compact Modeling of 3D Stacked Die Inter-Tier Microfluidic Cooling Under Non-Uniform Heat Flux

Multi-Scale Transient Thermal Analysis of Microelectronics

Compact Model Based Microfluidic Controller for Energy Efficient Thermal Management of Single Tier and 3D Chips

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