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Journal Articles

Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap

Yuanchen Hu, Md Obaidul Hossen, Zhimin Wan, Muhannad S. Bakir, Yogendra Joshi
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031007.
Paper No: EP-20-1045
DOI: https://doi.org/10.1115/1.4049814
Published Online: February 19, 2021
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Topics: Computational fluid dynamics, Cooling, Integrated circuits, Leakage, Simulation, Temperature, Transients (Dynamics), Fins, Steady state, Heat
Journal Articles

Single Phase Liquid Cooling of High Heat Flux Devices With Local Hotspot in a Microgap With Nonuniform Fin Array

Yuanchen Hu, Thomas Sarvey, Muhannad S. Bakir, Yogendra Joshi
Journal: Journal of Heat Transfer
Article Type: Research-Article
J. Heat Transfer. March 2021, 143(3): 031501.
Paper No: HT-20-1115
DOI: https://doi.org/10.1115/1.4049189
Published Online: January 18, 2021
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Topics: Cooling, Design, Flow (Dynamics), Heat flux, Hydrofoil, Pressure drop, Temperature, Coolants, Fins, Heat transfer coefficients
Proceedings Papers

Unusual Fast Evaporation From Nanoholes

Zhi Huang, Yuanchen Hu, Kang Liu, Xuejiao Hu
Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 2719-2724, November 9–15, 2012
Paper No: IMECE2012-87147
DOI: https://doi.org/10.1115/IMECE2012-87147
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Topics: Evaporation, Water, Vapors, Air conditioning, Cooling, Diffusion (Physics), Drying, Flow (Dynamics), Food products, Molecular dynamics