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Journal Articles

Embedded Microfluidic Cooling in Aluminum Nitride HTCC Substrate for High-Power Radio Frequency Chip Array

Yupu Ma, Tao Wei, Jiyu Qian, Jian Peng
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. October 2023, 15(10): 101004.
Paper No: TSEA-23-1003
https://doi.org/10.1115/1.4062400
Published Online: June 26, 2023
View Article titled, Embedded Microfluidic Cooling in Aluminum Nitride HTCC Substrate for High-Power Radio Frequency Chip Array
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Topics: Aluminum, Cooling, Heat, Microchannels, Microfluidics, Shells, Simulation, Temperature, Energy dissipation, Heating
Journal Articles

Packaging for Laser-Based White Lighting: Status and Perspectives

Yupu Ma, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2020, 142(1): 010801.
Paper No: EP-18-1105
https://doi.org/10.1115/1.4044359
Published Online: September 19, 2019
View Article titled, Packaging for Laser-Based White Lighting: Status and Perspectives
Open the PDF for Packaging for Laser-Based White Lighting: Status and Perspectives in another window
Topics: Lasers, Packaging, Phosphors, Quenching (Metalworking), Temperature, Laser beams, Brightness (Photometry)