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1-20 of 22
Zhuo Yang
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Proceedings Papers
Proc. ASME. IAM2022, 2022 International Additive Manufacturing Conference, V001T02A012, October 19–20, 2022
Paper No: IAM2022-96740
Proceedings Papers
Proc. ASME. IDETC-CIE2022, Volume 2: 42nd Computers and Information in Engineering Conference (CIE), V002T02A019, August 14–17, 2022
Paper No: DETC2022-91021
Proceedings Papers
Matthew M. Sato, Vivian Wen Hui Wong, Kincho H. Law, Ho Yeung, Zhuo Yang, Brandon Lane, Paul Witherell
Proc. ASME. IDETC-CIE2022, Volume 2: 42nd Computers and Information in Engineering Conference (CIE), V002T02A070, August 14–17, 2022
Paper No: DETC2022-88313
Proceedings Papers
Proc. ASME. IDETC-CIE2022, Volume 2: 42nd Computers and Information in Engineering Conference (CIE), V002T02A016, August 14–17, 2022
Paper No: DETC2022-89934
Journal Articles
Article Type: Research Papers
J. Comput. Inf. Sci. Eng. December 2022, 22(6): 061003.
Paper No: JCISE-21-1184
Published Online: May 10, 2022
Proceedings Papers
Proc. ASME. IDETC-CIE2021, Volume 2: 41st Computers and Information in Engineering Conference (CIE), V002T02A037, August 17–19, 2021
Paper No: DETC2021-69259
Proceedings Papers
Proc. ASME. IDETC-CIE2021, Volume 2: 41st Computers and Information in Engineering Conference (CIE), V002T02A031, August 17–19, 2021
Paper No: DETC2021-71266
Proceedings Papers
Proc. ASME. IDETC-CIE2021, Volume 2: 41st Computers and Information in Engineering Conference (CIE), V002T02A072, August 17–19, 2021
Paper No: DETC2021-71813
Journal Articles
Article Type: Research Papers
J. Comput. Inf. Sci. Eng. October 2021, 21(5): 050902.
Paper No: JCISE-20-1259
Published Online: May 12, 2021
Proceedings Papers
Proc. ASME. IMECE2020, Volume 2B: Advanced Manufacturing, V02BT02A045, November 16–19, 2020
Paper No: IMECE2020-24546
Proceedings Papers
Proc. ASME. IDETC-CIE2020, Volume 9: 40th Computers and Information in Engineering Conference (CIE), V009T09A028, August 17–19, 2020
Paper No: DETC2020-22615
Proceedings Papers
Proc. ASME. IDETC-CIE2020, Volume 9: 40th Computers and Information in Engineering Conference (CIE), V009T09A046, August 17–19, 2020
Paper No: DETC2020-22662
Proceedings Papers
Proc. ASME. HT2020, ASME 2020 Heat Transfer Summer Conference, V001T09A009, July 13–15, 2020
Paper No: HT2020-8990
Journal Articles
Article Type: Research Papers
J. Comput. Inf. Sci. Eng. October 2020, 20(5): 051001.
Paper No: JCISE-19-1292
Published Online: April 21, 2020
Proceedings Papers
Proc. ASME. IDETC-CIE2019, Volume 1: 39th Computers and Information in Engineering Conference, V001T02A010, August 18–21, 2019
Paper No: DETC2019-98215
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031008.
Paper No: EP-18-1108
Published Online: May 17, 2019
Proceedings Papers
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A022, August 27–30, 2018
Paper No: IPACK2018-8448
Proceedings Papers
Proc. ASME. IDETC-CIE2018, Volume 1A: 38th Computers and Information in Engineering Conference, V01AT02A009, August 26–29, 2018
Paper No: DETC2018-86055
Proceedings Papers
Proc. ASME. IDETC-CIE2018, Volume 1B: 38th Computers and Information in Engineering Conference, V01BT02A016, August 26–29, 2018
Paper No: DETC2018-85996
Proceedings Papers
Zhuo Yang, Thomas Hagedorn, Douglas Eddy, Sundar Krishnamurty, Ian Grosse, Peter Denno, Yan Lu, Paul Witherell
Proc. ASME. IDETC-CIE2017, Volume 1: 37th Computers and Information in Engineering Conference, V001T02A028, August 6–9, 2017
Paper No: DETC2017-67807