Graphene nanoplatelets (GNPs) have excellent thermal conductivity. It can significantly improve the heat-conducting property of epoxy resin (EP) matrix. In this paper, the GNPs/EP composites were successfully prepared by using ultrasonication and the cast molding method. The prepared GNPs/EP composites were systematically characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD), and thermal conductivity analyzer. Some factors affecting the thermal transfer performance of the composites were discussed. The defoamation has great influence on the thermal conductivity of composite. There is a nearly linear relationship between the mass fraction and the thermal conductivity of composite when the mass fraction of GNPs is below 4.3%. The results show that when the mass fraction of GNPs is 4.3% with crushing time of 2 s, the thermal conductivity of GNPs/EP composite is up to 0.99 W/m K. The thermal conductivity is increased by 9.0% compared with that without pulverization treatment (0.91 W/m K). When it is ground three times, the thermal conductivity of composite reaches the maximum (1.06 W/m K) and it is increased by 307.7% compared with that of epoxy resin matrix.
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February 2018
Research-Article
Enhanced Thermal Conductivity for Graphene Nanoplatelets/Epoxy Resin Composites
Dahai Zhu,
Dahai Zhu
School of Environment and
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
Search for other works by this author on:
Yu Qi,
Yu Qi
School of Environment and
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
Search for other works by this author on:
Wei Yu,
Wei Yu
School of Environment and Materials
Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
e-mail: yuwei@sspu.edu.cn
Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
e-mail: yuwei@sspu.edu.cn
Search for other works by this author on:
Lifei Chen,
Lifei Chen
School of Environment and
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
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Mingzhu Wang,
Mingzhu Wang
School of Environment and
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
Search for other works by this author on:
Huaqing Xie
Huaqing Xie
School of Environment and
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
e-mail: hqxie@sspu.edu.cn
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
e-mail: hqxie@sspu.edu.cn
Search for other works by this author on:
Dahai Zhu
School of Environment and
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
Yu Qi
School of Environment and
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
Wei Yu
School of Environment and Materials
Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
e-mail: yuwei@sspu.edu.cn
Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
e-mail: yuwei@sspu.edu.cn
Lifei Chen
School of Environment and
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
Mingzhu Wang
School of Environment and
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
Huaqing Xie
School of Environment and
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
e-mail: hqxie@sspu.edu.cn
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
e-mail: hqxie@sspu.edu.cn
1Corresponding authors.
Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF THERMAL SCIENCE AND ENGINEERING APPLICATIONS. Manuscript received January 6, 2017; final manuscript received March 21, 2017; published online July 25, 2017. Assoc. Editor: Jingchao Zhang.
J. Thermal Sci. Eng. Appl. Feb 2018, 10(1): 011011 (5 pages)
Published Online: July 25, 2017
Article history
Received:
January 6, 2017
Revised:
March 21, 2017
Citation
Zhu, D., Qi, Y., Yu, W., Chen, L., Wang, M., and Xie, H. (July 25, 2017). "Enhanced Thermal Conductivity for Graphene Nanoplatelets/Epoxy Resin Composites." ASME. J. Thermal Sci. Eng. Appl. February 2018; 10(1): 011011. https://doi.org/10.1115/1.4036796
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