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J. Thermal Sci. Eng. Appl. August 2023, 15(8): 081001. doi: https://doi.org/10.1115/1.4062184
J. Thermal Sci. Eng. Appl. August 2023, 15(8): 081002. doi: https://doi.org/10.1115/1.4062401
J. Thermal Sci. Eng. Appl. August 2023, 15(8): 081003. doi: https://doi.org/10.1115/1.4062433
J. Thermal Sci. Eng. Appl. August 2023, 15(8): 081004. doi: https://doi.org/10.1115/1.4062434
J. Thermal Sci. Eng. Appl. August 2023, 15(8): 081005. doi: https://doi.org/10.1115/1.4062399
J. Thermal Sci. Eng. Appl. August 2023, 15(8): 081006. doi: https://doi.org/10.1115/1.4062208
J. Thermal Sci. Eng. Appl. August 2023, 15(8): 081007. doi: https://doi.org/10.1115/1.4062183
J. Thermal Sci. Eng. Appl. August 2023, 15(8): 081008. doi: https://doi.org/10.1115/1.4062558
J. Thermal Sci. Eng. Appl. August 2023, 15(8): 081009. doi: https://doi.org/10.1115/1.4062333
J. Thermal Sci. Eng. Appl. August 2023, 15(8): 081010. doi: https://doi.org/10.1115/1.4062359
J. Thermal Sci. Eng. Appl. August 2023, 15(8): 081011. doi: https://doi.org/10.1115/1.4062501
J. Thermal Sci. Eng. Appl. August 2023, 15(8): 081012. doi: https://doi.org/10.1115/1.4062553

Technical Brief

J. Thermal Sci. Eng. Appl. August 2023, 15(8): 084501. doi: https://doi.org/10.1115/1.4062435
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