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Keywords: electronic cooling
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2024, 16(9): 091009.
Paper No: TSEA-24-1105
Published Online: July 12, 2024
...@cec.sc.edu 09 03 2024 09 06 2024 12 06 2024 12 07 2024 Graphical Abstract Figure heat pipe 3D printing flexible polymer dielectric electronic cooling Heat pipes are highly efficient thermal transfer devices that utilize the two-phase heat and mass...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2024, 16(9): 091006.
Paper No: TSEA-23-1499
Published Online: June 13, 2024
... for Electronics Cooling ,” Renew. Sustain. Energy Rev. , 78 , pp. 821 – 833 . 10.1016/j.rser.2017.04.112 [8] Hoang , C. H. , Rangarajan , S. , Manaserh , Y. , Tradat , M. , Mohsenian , G. , Choobineh , L. , Ortega , A. , Schiffres , S. , and Sammakia , B. , 2021...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. August 2024, 16(8): 081002.
Paper No: TSEA-23-1589
Published Online: May 23, 2024
... SHERPA algorithm structure optimization electronic cooling energy systems Graphical Abstract Figure 19 12 2023 27 04 2024 27 04 2024 23 05 2024 1 Corresponding author. Email: bingyun.jiang@zju.edu.cn Email: 13793126197@163.com Email: 2114835747...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. July 2024, 16(7): 071008.
Paper No: TSEA-23-1571
Published Online: May 10, 2024
...: amohanty_me@vssut.ac.in 08 12 2023 05 04 2024 14 04 2024 10 05 2024 Graphical Abstract Figure free convection heat sink design rectangular slots Nusselt number heat transfer neck position conduction electronic cooling extended surfaces/fins heat and mass...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. July 2024, 16(7): 071010.
Paper No: TSEA-24-1018
Published Online: May 10, 2024
... flow blockage volume-averaged simulations electronic cooling extended surfaces/fins heat exchangers heat transfer enhancement porous media High porosity aluminum foams have been widely studied in a variety of flow configurations, which involves channel flow [ 1 – 3 ], impingement systems...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2024, 16(6): 061010.
Paper No: TSEA-23-1568
Published Online: April 16, 2024
... bubbles electronic cooling heat transfer enhancement The continuous advancement in the functionality and miniaturization of electronic components facilitates a rapid surge in transistor counts within microprocessors, doubling every 2 years [ 1 ] and posing a challenge to effective thermal...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. April 2024, 16(4): 041009.
Paper No: TSEA-23-1373
Published Online: February 19, 2024
... a significant role in improving the efficiency and reliability of electronic components. These findings demonstrate the potential of using the nanofluids in thermosyphons to enhance their thermal performance in electronic cooling applications. Email: jobin.jose@vit.ac.in 1 Corresponding author. Email...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. April 2024, 16(4): 041004.
Paper No: TSEA-23-1360
Published Online: February 16, 2024
... , S. M. , and Nieto de Castro , C. A. , 2017 , “ A Critical Review of Traditional and Emerging Techniques and Fluids for Electronics Cooling ,” Renew. Sustain. Energy Rev. , 78 , pp. 821 – 833 . 10.1016/j.rser.2017.04.112 [21] Ghani , I. A. , Kamaruzaman , N. , and Sidik...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. March 2024, 16(3): 031003.
Paper No: TSEA-23-1358
Published Online: January 12, 2024
... generation prismatic battery system heat dissipation electronic cooling energy systems heat transfer enhancement natural and mixed convection thermal systems 11 08 2023 26 10 2023 06 11 2023 12 01 2024 1 Authors with equal contribution. 2 Corresponding author...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. February 2024, 16(2): 021006.
Paper No: TSEA-23-1274
Published Online: November 16, 2023
.... , Gradinger , T. , and Cottet , D. , 2014 , “ Compact Gravity Driven and Capillary-Sized Thermosyphon Loop for Power Electronics Cooling ,” ASME J. Therm. Sci. Eng. Appl. , 6 ( 3 ), p. 031003 . 10.1115/1.4026184 [3] Yan , Z. , Huang , H. , and Pan , Z. , 2023 , “ Bubble...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2023, 15(9): 091011.
Paper No: TSEA-22-1438
Published Online: July 27, 2023
... 1 Corresponding author. Email: vikas.lakhera@nirmauni.ac.in Email: atindra.sscssn@ddu.ac.in 18 09 2022 29 06 2023 03 07 2023 27 07 2023 miniature flat heat pipe (FHP) effective thermal conductivity working fluid orientation electronic cooling forced...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2023, 15(9): 091010.
Paper No: TSEA-22-1540
Published Online: July 27, 2023
... is used to predict the dimensions of the heat sink based on the charging times required for the electronic cooling application. The Stefan number for all the power inputs and at all orientations is calculated. Figure 11 shows the variation of charging time values with modified Stefan number at different...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. October 2023, 15(10): 101004.
Paper No: TSEA-23-1003
Published Online: June 26, 2023
... 2023 15 04 2023 16 04 2023 26 06 2023 aluminum nitride (AlN) HTCC embedded cooling microfluidic microchannel cooler electronic cooling forced convection heat and mass transfer heat transfer enhancement National Natural Science Foundation of China 10.13039...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2023, 15(9): 091005.
Paper No: TSEA-23-1053
Published Online: June 14, 2023
... thermal management system to cool down the downhole electronic components. downhole electronics vapor compression refrigeration exergy analysis harsh thermal environment thermal management system conduction electronic cooling energy efficiency heat and mass transfer heat transfer...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. August 2023, 15(8): 081009.
Paper No: TSEA-23-1056
Published Online: May 30, 2023
... cooling solution must provide uniform temperature distribution to effectively dissipate localized high heat fluxes, fulfilling practical cooling requirements [ 3 ]. Effective electronic cooling requires keeping the temperature within the permissible operating temperature limit of 70–80 °C [ 4 ]. Table 1...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2023, 15(6): 061004.
Paper No: TSEA-22-1390
Published Online: April 3, 2023
... conductivity as high as 31,824 W/m°C, which is quite suitable for electronics cooling. Orientation study revealed that horizontal orientation is comparatively better amongst all the other orientations for AGMBHP. Email: anand.bhatt@nirmauni.ac.in 1 Corresponding author. Email: sanjay.jain...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. April 2023, 15(4): 041010.
Paper No: TSEA-22-1451
Published Online: February 27, 2023
... 2023 01 02 2023 27 02 2023 proton exchange membrane fuel cell BOP cooling system parasitic power consumption system efficiency electronic cooling energy efficiency thermal systems National key scientific instrument and equipment development project of China 10.13039...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. January 2023, 15(1): 011006.
Paper No: TSEA-22-1170
Published Online: September 22, 2022
... synchronous motor gas–liquid two phase jet cooling numerical simulation electronic cooling heat transfer enhancement jets impingement cooling two-phase flow and heat transfer The permanent magnet synchronous motor (PMSM) is characterized by high-power density, high energy conversion efficiency...